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M55342K03G56G0P

Description
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 56ohm, 40V, 2% +/-Tol, -100,100ppm/Cel, 1105,
CategoryPassive components    The resistor   
File Size488KB,5 Pages
ManufacturerMini-Systems Inc (MSI)
Websitehttp://www.mini-systemsinc.com
Download Datasheet Parametric View All

M55342K03G56G0P Overview

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 56ohm, 40V, 2% +/-Tol, -100,100ppm/Cel, 1105,

M55342K03G56G0P Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid831677205
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.65
Other featuresPRECISION
structureChip
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.457 mm
Package length2.667 mm
Package formSMT
Package width1.27 mm
method of packingTray
Rated power dissipation(P)0.2 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance56 Ω
Resistor typeFIXED RESISTOR
size code1005
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal shapeWRAPAROUND
Tolerance2%
Operating Voltage75 V
QPL Precision Resistors
MSR
(Top Contact)
WA
(Wrap Around)
MWA
(Mini Wrap Around)
MINI-SYSTEMS, INC.
QPL PART NUMBER DESIGNATION
EXAMPLE:
M55342M01W10E0S
MIL-PRF-55342:
M55342
D = For /07 series only
M = all other series
Military Spec. Indicating
MIL=PRF-55342
Per MIL-PRF-55342, TCR ±300ppm, 0502 case size, Top Contact,
Gold base metal, 10KΩ, 1% tol., “S” Life Failure Rate
QPL thick film resistors are printed and fired on 96%
Alumina. All case sizes are offered to fit a variety of
Hi-Rel hybrid microelectronic applications. Advanced
processing techniques and, Hi-Rel Construction assure
optimum performance where TCR, VCR and operating
power are critical factors. All styles meet and exceed
the qualification requirements of MIL-PRF-55342.
Characteristic:
M
QPL Size:
01
Termination:
W
Material:
Base Metal
K = ±100ppm
M = ±300ppm
70 °C Max. ambient temperature at rated
wattage
See Tables on pages 16 & 17
W = Gold
Top Contact
T = Platinum Gold
Top Contact
D = Palladium Silver
Top Contact
B = Nickel Barrier,
Solder Coated
Wrap Around
G = Nickel Barrier,
Gold Plated
Wrap Around
C = Palladium Silver
Wrap Around
U = Platinum Gold
Wrap Around
Value and:
10EO
10KΩ, 1%
See pgs. 14 & 15 for tables III & IV
Tollerance
Of MIL-PRF-55342
Life Failure:
S
Rate
Product Level
C = Non-ER
M = 1.0% / 1000 Hrs.
P = 0.1% / 1000 Hrs.
R = 0.01% / 1999 Hrs.
S = 0.001% / 1000 Hrs.
T = Space Level
Packaged in chip trays if not specified.
12
E-mail: msithick@mini-systemsinc.com Web site: http://www.Mini-Systemsinc.com
MADE IN AMERICA
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