Wrap Around (WATF)
SURFACE MOUNT RESISTORS
Half-Wrap (HWTF)
Mini-Systems, Inc.
Surface Mount Chip Resistors
are available in a wide range of case sizes, with each size offered in wrap around and half wrap
termination styles. All solderable terminations have a nickel barrier for enhanced solder performance. This series is designed to be connected to
associated circuitry through wire-bonding, conductive epoxy or soldering. Mini-Systems, Inc. time tested materials produce chip resistors with high
stability, low noise and low TCR to provide the hybrid electronics industry resistor products with the highest standards available.
Solderable gold with nickel barrier
OR Nickel barrier pre-soldered
Solderable gold with nickel barrier
OR Nickel barrier pre-soldered
Isolated pad is wire bondable
GENERAL CHARACTERISTICS
Resistance Range
Resistance Tolerance
Termination Material
Operating Temperature
Storage Temperature
Operating Frequency
(NU) Solderable Gold with Nickel Barrier, (NT) Nickel with Solder
-55°C to +150°C
-65°C to +150°C
DC to 500 MHz
±0.01% to ±10%
1Ω to 6MΩ
SUBSTRATE CHARACTERISTICS
SUBSTRATE MATERIAL
99.6% Alumina
Beryllium Oxide
Aluminum Nitride
0.010" - 0.025"
Available
Thickness
Dielectric
Constant
@ 1MHz
6.7
9.9
9.0
Thermal
Conductivity
W/m• K
140 - 177
300
28
Current Noise
101Ω to 250kΩ
-35dB
-30dB
-30dB
≤ 100Ω > 250kΩ
-30dB
-20dB
-20dB
0.010" - 0.025"
RESISTOR CHARACTERISTICS
RESISTOR FILM
Tantalum Nitride
NiChrome
0.010" - 0.025"
Ta
2
O
5
(Self Passivating)
Passivation
SiO
2
Standard TCR
±25 ppm/°C
±150 ppm/°C
TCR Optional To:
±5 ppm/°C
NT3
D = ±5ppm/°C
C
= ±10ppm/°C
B = ±25ppm/°C
A = ±50ppm/°C
F
= ±100ppm/°C
NU = Soldereable Au w/ Ni barrier
NT3 = Nickel w/ SAC305 Solder
NT = Nickel w/ Sn62 Solder
TR = Tape and Reel
OPTION
±10 ppm/°C
PART NUMBER DESIGNATION
WATF
STYLE
WATF
HWTF
5
SEE
TABLE
TYPE
A
A = Alumina
B = BeO
N = AlN
SUBSTRATE
T
100R0
5-Digit Number:
1st 4 digits are significant
with "R" as decimal
point when required.
5th digit represents
number of zeros.
OHMIC VALUE
S
Q
B
D
F
G
J
K
=
=
=
=
=
=
=
=
F
TOLERANCE
±0.01%
±0.05%
±0.1%
±0.5%
±1%
±2%
±5%
±10%
T = Tantalum Nitride
N = NiChrome
RESISTOR FILM
EXAMPLE: WATF-5-AT-100R0F - NT3
WATF-5 Series, Alumina, Tantalum Nitride, 100Ω, ±1% Tol., Nickel w/ SAC305 Solder, RoHS Compliant
ISO 9001 CERTIFIED
20 DAVID ROAD
NORTH ATTLEBORO, MA 02760
EMAIL: msithin@Mini-SystemsInc.com
WEB:
www.Mini-SystemsInc.com
PHONE: 508-695-0203 FAX:508-695-6076
MINI SYSTEMS INC.
9
MADE IN AMERICA
SINCE 1968
8041 Rev. A
THIN FILM DIVISION
SURFACEPAGE TITLE
MOUNT RESISTORS
CASE
SIZE
TYPE
21
32
1
2
4
3
7
L
(±0.003")
[±0.076mm]
DIMENSIONS
W
(±0.003")
[±0.076mm]
0201
0202
0302
0402
0404
0502
0505
0603
0805
1005
1206
1505
0.020"
0.030”
[0.762]
[1.016]
[0.889]
[1.397]
[1.270]
[1.524]
[1.905]
[2.54]
[3.20]
[0.508]
0.020"
[0.508]
0.010"
0.020"
0.020"
0.035"
0.025"
0.050"
0.030"
0.050"
0.050"
0.063"
0.050"
[1.270]
[1.60]
[1.270]
[1.270]
[0.762]
[1.270]
[0.635]
[0.889]
[0.508]
0.040"
0.055"
0.060"
0.035"
0.050"
0.075"
0.020”
[0.508]
[0.254]
[0.508]
T
2
(±0.003")
[±0.076mm]
RESISTANCE RANGE
NiCr or TaN
(Std. TCR Only)
(Tol.≥0.5%)
POWER RATING
1
Alumina
50mW
AlN
200mW
BeO
400mW
1W
1W
2W
1W
2W
2W
Low Values
1Ω < 3Ω
1Ω < 3Ω
1Ω < 3Ω
-----------
-----------
-----------
-----------
-----------
-----------
1Ω < 3Ω
1Ω < 3Ω
1Ω < 3Ω
0.006"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.152]
3Ω - 130kΩ [190kΩ]
3Ω - 200kΩ [300kΩ]
1Ω - 325kΩ [500kΩ]
3Ω - 200kΩ [300kΩ]
3Ω - 250kΩ [400kΩ]
3Ω -300kΩ [500kΩ]
1Ω - 2.5MΩ [4MΩ]
1Ω - 3.5MΩ [5MΩ]
1Ω - 4MΩ [3.5MΩ]
1Ω - 4MΩ [6MΩ]
3Ω - 55kΩ [80kΩ]
Standard Values
NiCr or [TaN]
125mW
125mW
250mW
350mW
500mW
500mW
750mW
750mW
125mW
250mW
250mW
500mW
500mW
500mW
1W
1W
1W
8
63
6
5
9
1Ω - 750kΩ [1.25MΩ]
1.4W
2W
2W
3W
3W
2.8W
4W
4W
6W
6W
0.100"
0.126"
0.153"
[3.886]
1
2
Power Rating at 70°C derated linearly to 0% at 150°C
Thickness does not include solder
PERFORMANCE SPECIFICATIONS
PROPERTY
SHORT TERM OVERLOAD
HIGH TEMP EXPOSURE
THERMAL SHOCK
MOISTURE RESISTANCE
STABILITY
2.5xWVDC(6.25xRATED POWER)MIL-PRF-55342, +25°C, 5 SEC
MIL-STD 202 METHOD 108, 2000 HRS, +70°C, RATED POWER
MIL-STD 202, METHOD 107
MIL-STD 202, METHOD 106
+150°C, 100HRS
TEST CONDITION
±0.25 MAX ∆R/R
±0.20 MAX ∆R/R
±0.25 MAX ∆R/R
±0.40 MAX ∆R/R
±0.50 MAX ∆R/R
REQUIRED
LIMITS
±0.10 MAX ∆R/R
±0.03 MAX ∆R/R
±0.10 MAX ∆R/R
±0.10 MAX ∆R/R
±0.10 MAX ∆R/R
MSI TYPICAL
LIMITS
All WATF, HWTF Series parts are produced on the same manufacturing line using the same materials and processes as
parts manufactured to MIL-PRF-55342
ISO 9001 CERTIFIED
20 DAVID ROAD
NORTH ATTLEBORO, MA 02760
EMAIL: msithin@Mini-SystemsInc.com
WEB:
www.Mini-SystemsInc.com
PHONE: 508-695-0203 FAX:508-695-6076
MINI SYSTEMS INC.
MADE IN AMERICA
SINCE 1968
THIN FILM DIVISION
8041 Rev. A
10
GD32 MCU
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