1. While extensive efforts are driving GaN devices toward kilovolt applications, there are also huge opportunities on the ultra-low voltage (ULV) side, which is sometimes largely overlooked in the GaN...
Packaging terminology analysis (from "PCB Terminology Manual" V1.0)1. BGA (ball grid array)is a spherical contact array, one of the surface mount packages. Spherical bumps are made on the back of the ...
Linux has occupied half of the embedded operating system market with its advantages such as open source, high efficiency, customizability and small kernel. The wide application of embedded Linux in th...
[Urgent recruitment] Shanghai AGV company is urgently recruiting a large number of implementation engineers. Monthly salary: 4,000-7,000 yuan. Job responsibilities: (1) AGV on-site construction; (2) W...