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74HC240DB-T

Description
Buffers and line drivers octal 3-S buffer inv
Categorylogic    logic   
File Size113KB,18 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HC240DB-T Overview

Buffers and line drivers octal 3-S buffer inv

74HC240DB-T Parametric

Parameter NameAttribute value
Source Url Status Check Date2013-06-14 00:00:00
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP
package instructionSSOP,
Contacts20
Reach Compliance Codeunknow
seriesHC/UH
JESD-30 codeR-PDSO-G20
JESD-609 codee4
length7.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
Humidity sensitivity level1
Number of digits4
Number of functions2
Number of ports2
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityINVERTED
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)150 ns
Certification statusNot Qualified
Maximum seat height2 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width5.3 mm
Base Number Matches1
74HC240; 74HCT240
Octal buffer/line driver; 3-state; inverting
Rev. 03 — 2 August 2007
Product data sheet
1. General description
The 74HC240; 74HCT240 is a high-speed Si-gate CMOS device and is pin compatible
with Low-Power Schottky TTL (LSTTL).
The 74HC240; 74HCT240 is a dual octal inverting buffer/line driver with 3-state outputs.
The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on
nOE causes the outputs to assume a high impedance OFF-state.
The 74HC240; 74HCT240 is similar to the 74HC244; 74HCT244 but has inverting
outputs.
2. Features
s
s
s
s
Inverting 3-state outputs
Multiple package options
Complies with JEDEC standard no. 7 A
ESD protection:
x
HBM JESD22-A114-D exceeds 2000 V
x
MM JESD22-A115-A exceeds 200 V
s
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74HC240
74HC240N
74HC240D
74HC240DB
74HC240PW
74HC240BQ
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
DIP20
SO20
SSOP20
TSSOP20
plastic dual in-line package; 20 leads (300 mil)
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT146-1
SOT163-1
SOT339-1
Description
Version
Type number
plastic thin shrink small outline package; 20 leads; SOT360-1
body width 4.4 mm
DHVQFN20 plastic dual-in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm
DIP20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
74HCT240
74HCT240N
−40 °C
to +125
°C

74HC240DB-T Related Products

74HC240DB-T 935283683115 74HCT240N,652 74HC240N,652 935283684115
Description Buffers and line drivers octal 3-S buffer inv HC/UH SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20 IC BUFFER INVERT 5.5V 20DIP IC BUFFER INVERT 6V 20DIP HCT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20
package instruction SSOP, HVQCCN, DIP, DIP20,.3 DIP, DIP20,.3 HVQCCN,
Reach Compliance Code unknow unknow compliant compliant unknow
series HC/UH HC/UH HCT HC/UH HCT
JESD-30 code R-PDSO-G20 R-PQCC-N20 R-PDIP-T20 R-PDIP-T20 R-PQCC-N20
length 7.2 mm 4.5 mm 26.73 mm 26.73 mm 4.5 mm
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
Number of digits 4 4 4 4 4
Number of functions 2 2 2 2 2
Number of ports 2 2 2 2 2
Number of terminals 20 20 20 20 20
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity INVERTED INVERTED INVERTED INVERTED INVERTED
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP HVQCCN DIP DIP HVQCCN
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE IN-LINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
propagation delay (tpd) 150 ns 150 ns 30 ns 150 ns 30 ns
Maximum seat height 2 mm 1 mm 4.2 mm 4.2 mm 1 mm
Maximum supply voltage (Vsup) 6 V 6 V 5.5 V 6 V 5.5 V
Minimum supply voltage (Vsup) 2 V 2 V 4.5 V 2 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form GULL WING NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD
Terminal pitch 0.65 mm 0.5 mm 2.54 mm 2.54 mm 0.5 mm
Terminal location DUAL QUAD DUAL DUAL QUAD
width 5.3 mm 2.5 mm 7.62 mm 7.62 mm 2.5 mm
Is it Rohs certified? conform to - conform to conform to -
Maker NXP - NXP NXP NXP
Parts packaging code SSOP - DIP DIP -
Contacts 20 - 20 20 -
JESD-609 code e4 - e4 e4 -
Load capacitance (CL) 50 pF - 50 pF 50 pF -
Peak Reflow Temperature (Celsius) 260 - 260 260 -
Certification status Not Qualified - Not Qualified Not Qualified -
Terminal surface NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) -
Maximum time at peak reflow temperature 30 - 30 30 -
Base Number Matches 1 1 1 1 -
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