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UPD46365094BF1-E33-EQ1

Description
QDR SRAM
Categorystorage    storage   
File Size592KB,39 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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UPD46365094BF1-E33-EQ1 Overview

QDR SRAM

UPD46365094BF1-E33-EQ1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1277419882
package instructionBGA-165
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Samacsys DescriptionQDRII/DDRII/ QDRII+/DDRII+ SRAM
Samacsys ManufacturerRenesas Electronics
Samacsys Modified On2022-04-28 13:17:55
Maximum access time0.45 ns
JESD-30 codeR-PBGA-B165
length15 mm
memory density37748736 bit
Memory IC TypeQDR SRAM
memory width9
Number of functions1
Number of terminals165
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX9
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height1.46 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
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