SnPb end metallization option available upon request
(5% Pb minimum)
Applications
Typical applications include military, space quality and high reliability electronics.
Packaging C-Spec Ordering Options Table (100% Matte Sn and SnPb Terminations)
Packaging Type
1
Bulk Bag/Unmarked
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch
2
13" Reel/Unmarked/2 mm pitch
2
1
1
Packaging/Grade
Ordering Code (C-Spec)
Not required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see “Capacitor Marking”.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
“Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric).
2
“Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric).
3
The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices.
3
Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 through 2225 case
size devices with chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options
may be available. Contact KEMET for details.
4
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
5
Additional reeling or packaging options may be available. Contact KEMET for details.
I saw this sentence in the ESP32 data sheet:
ESP32-S2 uses the Harvard-structured Xtensa LX7 CPU to form a single-core system. All internal memories, external memories, and peripherals are distributed...
As China's maglev trains develop from experiments to industrialization, the power supply voltage of its main circuit has moved from the previous DC: 750V to a higher voltage DC: 1500V. Although high-v...
1 TMSC2000 SeriesThe C2000 series DSP is one of the three major series of TI's TMS320 DSP. It includes 16-bit C24xx and 32-bit C28xx fixed-point DSPs. It is based on the 320C2XLP core, a 4-stage pipel...
1. Routine testThe routine ch2601_rgb_marquee_demo provided by RVB2601 already has the GPIO control method and PWM control method of the RGB tricolor light, which was tested. However, there must be so...
In my previous blog "PIC32MZ tutorial -- Output Compare", I shows how to apply Output Compare without interrupt to generate PWM signal. I also tried the Output Compare interrupt. I selected OC to b...[Details]
/********************************************************
007.ASM
wiring: P0 port connects to digital tube and
P2 port connects to matrix keyboard
Use timer interrupt, if there is no operati...[Details]
This article discusses the design of a mixed-signal universal battery charger that can charge both Li-Ion and NiMH batteries. System Considerations for Battery Charging To charge the battery ...[Details]
Since the dual in-line (DIP) intelligent power module (IPM) has a built-in high voltage integrated circuit (HVIC), it is possible to use a single control power supply. The performance requirements ...[Details]
On November 2, 2023, Dalianda Holdings, a leading international semiconductor component distributor committed to the Asia-Pacific market , announced that its subsidiary Pinjia launched a BLDC freque...[Details]
0 Introduction
In order to solve the three major problems of phase deviation observation, recording and calibration in manual adjustment of power transmission lines. This design realizes the mo...[Details]
Bridge Measurement Overview
There are many types of bridge sensors available, including strain gages, load cells, pressure sensors, and torque sensors. Bridge sensors use a passive resistor ne...[Details]
2022 will become the first year of lidar mass production, and many lidar companies have delivered good mass production answers. But no matter from the perspective of technology research and developme...[Details]
Recently, the "2017 Global Smart Inverter Application Technology Summit" was grandly opened in China Dragon City - Changzhou, Jiangsu. The conference held the award ceremony for the 2017 Global Sma...[Details]
The second day of NIWeeK 2019 was on time. In his opening remarks, Scott Rust, Vice President of Product Development at NI, said that according to a research report from Harvard Business School, the ...[Details]
OFweek Cup 2022 China
Robot
Industry Annual Awards (abbreviated as OFweek Robot Awards 2022) is jointly organized by OFweek, China's high-tech industry portal, and its authoritative robot p...[Details]
The rich on-chip device modules and configurable fuse options are one of the advantages of AVR over the older generation of MCUs. However, after the advent of STM8S, this advantage of AVR has lost som...[Details]
LG Electronics has issued a statement regarding the potential future of its mobile communications or smartphone business, possibly to reassure employees as the company may end its mobile phone busine...[Details]
Zhou Weiping, vice president of Hua Hong Semiconductor, delivered a report titled "Dual-core Engine, Green Intelligent Manufacturing, Winning the Chip Future" at the 23rd China Integrated Circuit Man...[Details]
October 16, 2024 -
In the wave of global digital transformation and the rise of big models, the global computing power industry is gradually shifting from being centered on computing units to b...[Details]
Domestic Chip Exchange
京公网安备 11010802033920号
EEWORLD
