Features .......................................................................................................................................................................................1
Ordering Information .....................................................................................................................................................................2
Dimensions and Patterns ― 3.2 x 2.5 mm .................................................................................................................................14
Dimensions and Patterns ― 5.0 x 3.2 mm .................................................................................................................................14
Dimensions and Patterns ― 7.0 x 5.0 mm .................................................................................................................................15
Additional Information .................................................................................................................................................................16
Revision History ..........................................................................................................................................................................17
Rev 1.07
Page 3 of 17
www.sitime.com
SiT3373
220 MHz to 725 MHz Ultra-low Jitter Differential VCXO
Electrical Characteristics
Table 2. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with standard
output termination shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Parameter
Output Frequency Range
Frequency Stability
Symbol
f
F_stab
Min.
220.000001
-15
-25
-35
-50
Operating Temperature Range
T_use
-20
-40
-40
-40
Supply Voltage
Vdd
2.97
2.70
2.52
2.25
Pull Range
Upper Control Voltage
Lower Control Voltage
Control Voltage Input Impedance
Control Voltage Input Bandwidth
Pull Range Linearity
Frequency Change Polarity
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
Duty Cycle
Start-up Time
OE Enable/Disable Time
PR
VC_U
VC_L
VC_z
V_c
Lin
–
VIH
VIL
Z_in
DC
T_start
T_oe
70%
–
–
45
–
–
Typ.
–
–
–
–
–
–
–
–
–
3.30
3.00
2.80
2.50
Max.
725
+15
+25
+35
+50
+70
+85
+95
+105
Supply Voltage
3.63
3.30
3.08
2.75
V
V
V
V
ppm
Vdd
Vdd
MΩ
kHz
%
–
–
30%
-
55
3.0
3.8
Vdd
Vdd
kΩ
%
ms
µs
Measured from the time Vdd reaches its rated minimum value.
f = 322.265625 MHz. Measured from the time OE pin reaches
rated VIH and VIL to the time clock pins reach 90% of swing
and high-Z. See
Figure 9
and
Figure 10
Pin 2, OE
Pin 2, OE
Pin 2, OE logic high or logic low
Contact SiTime
for other input bandwidth options
See the APR (Absolute Pull Range)
Table 11.
Contact SiTime
for custom pull range options
Voltage at which maximum frequency deviation is guaranteed
Voltage at which minimum frequency deviation is guaranteed
Unit
MHz
ppm
ppm
ppm
ppm
°C
°C
°C
°C
Extended Industrial
Extended Commercial
Industrial
Condition
Accurate to 6 decimal places
Inclusive of initial tolerance, operating temperature, rated
power supply voltage, load variations, and first year aging
at 25°C, with VIN voltage at Vdd/2.
±15
ppm is only guaranteed for pull range up to
±100
ppm.
Frequency Range
Frequency Stability
Temperature Range
Voltage Control Characteristics
±25, ±50, ±80, ±100, ±150, ±200,
±400, ±800, ±1600, ±3200
90%
–
–
–
–
–
–
10
10
–
Positive Slope
–
–
100
–
–
–
–
10%
–
–
1.0
Input Characteristics
Output Characteristics
Startup and OE Timing
Rev 1.07
Page 4 of 17
www.sitime.com
SiT3373
220 MHz to 725 MHz Ultra-low Jitter Differential VCXO
Table 3. Electrical Characteristics – LVPECL Specific
Parameter
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Maximum Output Current
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
RMS Period Jitter
[4]
RMS Phase Jitter (random)
Symbol
Idd
I_OE
I_leak
I_driver
VOH
VOL
V_Swing
Tr, Tf
T_jitt
T_phj
–
0.220
0.270
ps
Min.
–
–
–
–
Vdd-1.15
Vdd-1.9
1.2
–
–
Typ.
–
–
0.15
–
–
–
1.6
225
1.0
Max.
97
63
–
32
Vdd-0.7
Vdd-1.5
2.0
290
1.6
Unit
mA
mA
A
mA
V
V
V
ps
ps
Condition
Excluding Load Termination Current, Vdd = 3.3 V or 2.5 V
OE = Low
OE = Low
Maximum average current drawn from OUT+ or OUT-
See
Figure 5
See
Figure 5
See
Figure 6
20% to 80%, see
Figure 6
f = 322.265625 MHz, Vdd = 3.3 V or 2.5 V
f = 322.265625 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels, includes spurs, pull range =
±100
ppm.
Temperature ranges -20 to 70°C and -40 to 85°C
f = 322.265625 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels, includes spurs, pull range =
±100
ppm.
Temperature ranges -40 to 95°C and -40 to 105°C
f = 156.25 or 322.265625 MHz, IEEE802.3-2005 10 GbE jitter
mask integration bandwidth = 1.875 MHz to 20 MHz,
all Vdd levels
f = 322.265625 MHz, Vdd = 3.3 V or 2.5 V
f = 322.265625 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels, includes spurs, pull range =
±100
ppm.
Temperature ranges -20 to 70°C and -40 to 85°C
f = 322.265625 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels, includes spurs, pull range =
±100
ppm.
Temperature ranges -40 to 95°C and -40 to 105°C
f = 322.265625 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
S/PDIF interface output is divided into the following two types:Is the output in the form of optical fiber?
Are the two blue boxes in the coaxial output in Figure 2 used to differentiate the signals?...
Please don't misunderstand when you see the picture, this is a failed test just like SPI! Failed test!
I didn't want to write this originally, but I thought since it's a test, I should record the test...
[i=s]This post was last edited by damiaa on 2020-9-4 12:15[/i]Everyone is discussing domestic MCUs very enthusiastically. I wonder which domestic MCUs are better than EMC?
The CPU's peripheral EMC cir...
Analog video signals are mixed with DC power for transmission
Using a non-differential transmission method, the video signal is mixed with the power supply for transmission, and the receiving end sepa...
Efficient use of power is at the core of electronic device design.
From 5G base stations, phased array antennas, data centers and vehicles to tablets, smartphones and video doorbells, designers know t...
"Doctor, doctor, am I deaf?"Doctor Guan had just finished examining a worker when a sunny and handsome young man rushed into the occupational health examination room with a hearing test form. Before D...
I don't know when it started, but everyone likes to describe Audi as a "lighting factory". It seems that car lights have become an important way for Audi to be familiar to people. Looking back over ...[Details]
Special scholarships support future talents to conduct innovative research and promote the rapid development of MEMS manufacturing process technology IMT (Innovative Micro Technology), an independe...[Details]
In recent years, car cockpit audio systems have received more and more attention. Electric vehicles have broken the previous restrictions on the use of electrical equipment in fuel vehicles when pa...[Details]
Today I will share with you a motor control chip. As the functions of chips become increasingly powerful, the integration of chips is getting higher and higher. Many capabilities of previously sepa...[Details]
On June 29, at the Semiconductor Industry Development Summit Forum of the Lingang New Area of China (Shanghai) Free Trade Zone, Su Wei, General Manager of China Resources Microelectronics Foundry B...[Details]
According to the Times of Israel, U.S. semiconductor giant Intel has signed an in-principle agreement with the Israeli government to invest $25 billion to build a chip manufacturing plant in Kiryat G...[Details]
On October 14, Nationstar Optoelectronics released its performance forecast, stating that the company expects to achieve a net profit attributable to shareholders of listed companies of 170 million y...[Details]
Oscilloscope detection of various noises in the environment and setting methods to reduce interference The function of an oscilloscope is to restore the real signal. The higher the performance of th...[Details]
Zhang Tianfu, founder and CEO of Mizhi Technology, shared Mizhi Technology's application in AR algorithm scenarios and rendering engines at the Khronos·VeriSilicon Technology Seminar. Zhang Tianfu sa...[Details]
Today, Xiaomi’s official overseas account released a warm-up poster on Twitter, announcing that it will hold an online press conference at 8 pm Beijing time on September 15, and is expected to releas...[Details]
China Energy Storage Network News:
On April 29, the country's first 5G shared base station that simultaneously deploys equipment from the three major telecommunications operators, China Mobil...[Details]
According to foreign media reports, researchers at the Massachusetts Institute of Technology (MIT) have created a diamond-based quantum sensor on a silicon chip for the first time, paving the way for...[Details]
On March 2, Drew Baglino, Tesla’s senior vice president of power system and energy engineering, said at the company’s Investor Day event that the large-scale promotion of new energy vehicles requires...[Details]
On October 24, Bloomberg reported yesterday that Arm plans to cancel the license that allows its long-term partner Qualcomm to use Arm intellectual property to design chips.
Today, analy...[Details]