Ecliptek | EMRC23 Series Oscillator
http://www.ecliptek.com/oscillators/EMRC23/
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EMRC23 Series Oscillator
MEMS Clock Oscillators LVPECL (PECL) 3.3Vdc 6 Pad 3.2mm x 5.0mm Plastic Surface Mount (SMD)
2011/65 +
2015/863
168 SVHC
Revision A 05/11/2012
Electrical Specifications
Nominal Frequency
1.000MHz to 625.000MHz
Some frequencies within this range may not be available.
Frequency Tolerance/Stability
(Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency
Stability over the Operating Temperature Range, Supply Voltage
Change, Output Load Change, First Year Aging at 25°C, Reflow, Shock,
and Vibration)
±100ppm Maximum
±50ppm Maximum
±25ppm Maximum
±20ppm Maximum
0°C to +70°C
-20°C to +70°C
-40°C to +85°C
3.3V
DC
±10%
Excluding Load Termination Current
60mA Typical, 70mA Maximum
V
DD
-1.10V
DC
Minimum, 2.40V
DC
Typical, V
DD
-0.70V
DC
Maximum
V
DD
-1.90V
DC
Minimum, 1.60V
DC
Typical, V
DD
-1.50V
DC
Maximum
600mVdc Minimum, 800mVdc Typical, 1000mVdc Maximum
Measured at 50% of waveform
50 ±10(%)
50 ±5(%) (Not available over Nominal Frequency range of
312.500001MHz to 524.999999MHz)
Measured at 20% to 80% of Waveform
300pSec Typical, 500pSec Maximum
50 Ohms into V
CC
-2.0V
DC
LVPECL
Output Enable (OE) and Complementary Output
Vih of 70% of Vdd Minimum or No Connect to Enable Output and
Complementary Output, Vil of 30% of V
DD
Maximum to Disable Output
and Complementary Output (High Impedance)
35mA Maximum (OE) Without Load at Logic Control / Additional
Output of Output Enable (OE) and Complementary Output
Fj = 12kHz to 20MHz; Random
0.5pSec Typical, 1pSec Maximum
0.2pSec Typical
Operating Temperature Range
Supply Voltage (V
DD
)
Input Current
Output Voltage Logic High (V
OH
)
Output Voltage Logic Low (V
OL
)
Output Swing (VOpp)
Duty Cycle
Rise Time/Fall Time
Load Drive Capability
Output Logic Type
Logic Control / Additional Output
Output Control Input Voltage
Output Enable Current
RMS Phase Jitter
Period Jitter (Deterministic)
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Ecliptek | EMRC23 Series Oscillator
http://www.ecliptek.com/oscillators/EMRC23/
Environmental and Mechanical Specifications
ESD Susceptibility:
Flammability:
Mechanical Shock:
Moisture Resistance:
Moisture Sensitivity Level:
Resistance to Soldering Heat:
Resistance to Solvents:
Solderability:
Temperature Cycling:
Thermal Shock:
Vibration:
Thermal Resistance (θ
JA
):
Thermal Resistance (θ
JC
):
MIL-STD-883, Method 3015, Class 2, HBM:2000V
UL94-V0
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only)
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
68°C/W (degrees Celsius per Watt)
45°C/W (degrees Celsius per Watt)
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PCB Design
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