Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L” x W”) and thickness dimension. See “Chip Thickness/Tape & Reel
Packaging Quantities” and “Tape & Reel Packaging Information”.
3
For additional Information regarding “AUTO” C-Spec options, see “Automotive C-Spec Information”.
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see “Capacitor Marking”.
Benefits
−55°C to +150°C operating temperature range
Superior flex performance (up to 5 mm)
Lead (Pb)-free, RoHS and REACH compliant
EIA 0603, 0805, 1206, 1210, and 1812 case sizes
DC voltage ratings of 10 V, 16 V, 25 V, 50 V and 100 V
Capacitance offerings ranging from 0.5 pF to 0.22 μF
Available capacitance tolerances of ±0.10 pf, ±0.25 pf,
±0.5 pf, ±1%, ±2%, ±5%,
±10%, and ±20%
• Extremely low ESR and ESL
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• High thermal stability
• High ripple current capability
• No capacitance change with respect to applied rated DC
J-Link not only supports the burning of the Flash on the MCU , but also can directly burn the SPI Flash through the SPI protocol. Because the SPI protocol is used , even if the MCU connected to the SP...
The source program is as follows:/** main.c*/
#include "DSP28x_Project.h"// Device Headerfile and Examples Include File
// Prototype statements for functions found within this file.
void InitEPwm1Exam...
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