SST39WF800B-70-4I-M2QE datasheet, PDF

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SST39WF800B-70-4I-M2QE: Description512K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-225, WFBGA-48; Categorystorage storage; File Size861KB，26 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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SST39WF800B-70-4I-M2QE Overview

512K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-225, WFBGA-48

SST39WF800B-70-4I-M2QE Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	BGA
package instruction	5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-225, WFBGA-48
Contacts	48
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	70 ns
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	6 mm
memory density	8388608 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	48
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	0.73 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	5 mm

SST39WF800B-70-4I-M2QE Related Products

	SST39WF800B-70-4I-M2QE	SST39WF800B-70-4C-M2QE	SST39WF800B-70-4C-MBQE	SST39WF800B-70-4I-MBQE
Description	512K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-225, WFBGA-48	512K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-225, WFBGA-48	512K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-225, WFBGA-48	512K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-225, WFBGA-48
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Microchip	Microchip	Microchip	Microchip
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-225, WFBGA-48	VFBGA,	VFBGA,	VFBGA,
Contacts	48	48	48	48
Reach Compliance Code	compli	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	70 ns	70 ns	70 ns	70 ns
JESD-30 code	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
JESD-609 code	e1	e1	e1	e1
length	6 mm	6 mm	6 mm	6 mm
memory density	8388608 bi	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16
Number of functions	1	1	1	1
Number of terminals	48	48	48	48
word count	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C
organize	512KX16	512KX16	512KX16	512KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	VFBGA	VFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260	260
Programming voltage	1.8 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.73 mm	0.73 mm	0.73 mm	0.73 mm
Maximum supply voltage (Vsup)	1.95 V	1.95 V	1.95 V	1.95 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40	40
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	5 mm	5 mm	5 mm	5 mm

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