EEWORLDEEWORLDEEWORLD

Part Number

Search

SFM27-B-H

Description
Rectifier Diode, 1 Phase, 1 Element, 2A, 500V V(RRM), Silicon, DO-214AA, SMB, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size57KB,7 Pages
ManufacturerFORMOSA
Websitehttp://www.formosams.com/
Download Datasheet Parametric View All

SFM27-B-H Overview

Rectifier Diode, 1 Phase, 1 Element, 2A, 500V V(RRM), Silicon, DO-214AA, SMB, 2 PIN

SFM27-B-H Parametric

Parameter NameAttribute value
Objectid1288177586
package instructionR-PDSO-F2
Reach Compliance Codeunknown
ECCN codeEAR99
applicationSUPER FAST RECOVERY
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1.7 V
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-F2
Maximum non-repetitive peak forward current50 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current2 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Maximum repetitive peak reverse voltage500 V
Maximum reverse current5 µA
Maximum reverse recovery time0.035 µs
surface mountYES
Terminal formFLAT
Terminal locationDUAL

SFM27-B-H Preview

Chip Super Fast Rectifiers Rectifier
SFM21-B THRU SFM28-B
List
Formosa MS
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 1
DS-121430
Chip Super Fast Rectifiers Rectifier
SFM21-B THRU SFM28-B
2.0A Surface Mount Super
Fast Rectifiers-50-600V
Features
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Formosa MS
SMB
0.213(5.4)
0.197(5.0)
Package outline
Low profile surface mounted application in order to
optimize board space.
High current capability.
Superfast recovery tim for switching mode application.
High surge current capability.
Glass passivated chip junction.
Lead-free parts meet RoHS requirments.
Suffix "-H" indicates Halogen free parts, ex. SFM21-B-H.
0.016(0.4) Typ.
0.142(3.6)
0.126(3.2)
Mechanical data
Epoxy:UL94-V0 rated flame retardant
Case : Molded plastic, DO-214AA / SMB
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.075(1.9)
0.067(1.7)
0.032(0.8) Typ.
0.032 (0.8) Typ.
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : Approximated 0.09 gram
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics
(AT
PARAMETER
Forward rectified current
Forward surge current
See Fig.2
CONDITIONS
T
A
=25 C unless otherwise noted)
Symbol
I
O
I
FSM
I
R
R
θJA
R
θJC
C
J
T
STG
-65
33
20
25
+175
MIN.
TYP.
MAX.
2.0
50
5.0
100
O
o
UNIT
A
A
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V
R
= V
RRM
T
J
= 25 C
V
R
= V
RRM
T
J
= 125 C
Junction to ambient
, note 2
Junction to case, note 2
O
O
Reverse current
Typical thermal resistance
Diode junction capacitance
Storage temperature
*1
V
RRM
(V)
50
100
150
200
300
400
500
600
V
RMS
*2
(V)
35
70
105
140
210
280
350
420
μA
C/W
pF
O
f=1MHz and applied 4V DC reverse voltage
C
SYMBOLS
SFM21-B
SFM22-B
SFM23-B
SFM24-B
SFM25-B
SFM26-B
SFM27-B
SFM28-B
*3
V
R
(V)
50
100
150
200
300
400
500
600
*4
V
F
(V)
*5
t
rr
(ns)
Operating
temperature
T
J
, (
O
C)
*1 Repetitive peak reverse voltage
*2 RMS voltage
0.95
*3 Continuous reverse voltage
35
1.25
1.70
-55 to +150
*4 Maximum forward voltage@I
F
=2.0A
*5 Maximum Reverse recovery time , note 1
Note 1. Reverse recovery time test condition, I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
2.
Mounted on 3.6 mm x 1.5 mm PCB
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 2
DS-121430
Rating and characteristic curves (SFM21-B THRU SFM28-B)
FIG.1-TYPICAL FORWARD
CHARACTERISTICS
10
AVERAGE FORWARD CURRENT,(A)
24
-B
FM
26
-B
FIG.2-TYPICAL FORWARD CURRENT
DERATING CURVE
2.8
2 .4
2 .0
1.6
1 .2
.8
.4
0
0
P.C.B. Mounted on
3.6 mm x 1.5 mm
Copper Pad Areas
FM
INSTANTANEOUS FORWARD CURRENT,(A)
M2
1-B
~S
M2
5-
B
~S
.1
T
J
=25 C
Pulse Width 300us
1% Duty Cycle
SF
M2
7
-B
~
1.0
SF
SF
SF
M2
8
-B
20
40
60
80
100
120
140
160
180
LEAD TEMPERATURE (°C)
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE CURRENT,(A)
50
.01
.001
.4
.6
.8
1.0
1.2
1.4
1.6
1.8
40
FORWARD VOLTAGE,(V)
FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE
RECOVERY TIME CHARACTERISTICS
50
W
NONINDUCTIVE
10
W
NONINDUCTIVE
30
T
J
=25 C
8.3ms Single Half
Sine Wave
JEDEC method
20
10
(+)
25Vdc
(approx.)
( )
1
W
NON-
INDUCTIVE
OSCILLISCOPE
(NOTE 1)
D.U.T.
( )
PULSE
GENERATOR
(NOTE 2)
(+)
0
1
5
10
50
100
NUMBER OF CYCLES AT 60Hz
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.
2. Rise Time= 10ns max., Source Impedance= 50 ohms.
FIG.5-TYPICAL JUNCTION CAPACITANCE
70
trr
+0.5A
|
|
|
|
|
|
|
|
JUNCTION CAPACITANCE,(pF)
60
50
40
30
20
10
0
-0.25A
-1.0A
1cm
SET TIME BASE FOR
50 / 10ns / cm
0
.01
.05
.1
.5
1
5
10
50
100
REVERSE VOLTAGE,(V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 3
DS-121430
Chip Super Fast Rectifiers Rectifier
SFM21-B THRU SFM28-B
Pinning information
Pin
Pin1
Pin2
cathode
anode
Simplified outline
Formosa MS
Symbol
1
2
1
2
Marking
Type number
SFM21-B
SFM22-B
SFM23-B
SFM24-B
SFM25-B
SFM26-B
SFM27-B
SFM28-B
Marking code
S21
S22
S23
S24
S25
S26
S27
S28
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
SMB
A
0.142 (3.60)
B
0.059 (1.50)
C
0.118 (3.00)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 4
DS-121430
Chip Super Fast Rectifiers Rectifier
SFM21-B THRU SFM28-B
Packing information
P
0
P
1
d
E
F
B
W
Formosa MS
A
P
D
2
T
C
D
W
1
D
1
unit:mm
Item
Symbol
Tolerance
SMB
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D
1
D
D
1
D
2
E
F
P
P
0
P
1
T
W
W
1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.81
5.74
2.24
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
8.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 5
DS-121430
PADS9.5 Gerber screen printing changes to copper wire
I used PADS9.5 to generate the Gerber file. Before generating the Gerber file, the design had passed verification (connectivity, spacing, etc. were all normal). When generating the Gerber file, the si...
wolfskin PCB Design
ADF4351 chip
What is the range of channel step resolution?...
zhang520 ADI Reference Circuit
TMS320C6678 Development Routine User Manual Study Part 3
Burning multi-core and multi-image files The GEL file here uses the DSP_C6678_MultiCoreBoot.gel file in the Images folder of the CD. Please install Python 2.x or above in advance. The installation pro...
火辣西米秀 Microcontroller MCU
QuartusII for Altera FPGA development example 1
[i=s]This post was last edited by Yufeng on 2020-8-4 19:20[/i]Board: Altera DE2-35 Functional description: The first test demo Function: switch control light#源文件 # SW LEDR 在pin planer中配置 module part1 ...
昱枫 Altera SoC
Basic knowledge of smart home technology
Smart home has been integrated into every aspect of our lives, such as smart home, smart office, smart campus, smart hotel, etc. As smart home devices become more and more affordable, smart home is no...
石榴姐 RF/Wirelessly
A DIY DC to DC negative pressure module
This module is made of integrated block LTC3863. The specifications and size are very small, only the size of one RMB yuan. 1. This is the introduction of some chip materials:2. Chip recommended circu...
btty038 Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号