1PMT4614DE3 datasheet, PDF - EEWORLD Datasheet

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1PMT4614DE3: DescriptionZener Diode, 1.8V V(Z), 1%, 0.5W, Silicon, Unidirectional, DO-216AA, ROHS COMPLIANT, DO-216, POWERMITE-2; CategoryDiscrete semiconductor diode; File Size111KB，4 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

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1PMT4614DE3 Overview

Zener Diode, 1.8V V(Z), 1%, 0.5W, Silicon, Unidirectional, DO-216AA, ROHS COMPLIANT, DO-216, POWERMITE-2

1PMT4614DE3 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microsemi
Parts packaging code	DO-216
package instruction	S-PSSO-G1
Contacts	2
Reach Compliance Code	compliant
ECCN code	EAR99
Is Samacsys	N
Other features	LOW NOISE
Shell connection	CATHODE
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	1200 Ω
JEDEC-95 code	DO-216AA
JESD-30 code	S-PSSO-G1
JESD-609 code	e3
Number of components	1
Number of terminals	1
Maximum operating temperature	150 °C
Package body material	PLASTIC/EPOXY
Package shape	SQUARE
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.5 W
Certification status	Not Qualified
Nominal reference voltage	1.8 V
surface mount	YES
technology	ZENER
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal location	SINGLE
Maximum time at peak reflow temperature	40
Maximum voltage tolerance	1%
Working test current	0.25 mA
Base Number Matches	1

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1PMT4614e3 thru 1PMT4627e3,

1PMT4099e3 thru 1PMT4135e3

SCOTTSDALE DIVISION

POWERMITE

Low Noise 1 Watt Zener Diodes

DESCRIPTION

This Microsemi Powermite

surface mount low noise Zener package series

provides a higher power handling capability that are also RoHS compliant.

In addition to its size advantages, Powermite

package features include a

full-metallic bottom that eliminates the possibility of solder flux entrapment

during assembly, and a unique locking tab acts as an efficient heat path

from die to mounting plane for external heat sinking with very low thermal

resistance junction to case (bottom). Its innovative design makes this

device ideal for use with automatic insertion equipment.

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

APPEARANCE

WWW .

Microsemi

DO-216

FEATURES

•

Surface mount equivalent to JEDEC registered

1N4099 thru 1N4135 and 1N4614 thru 1N4627

series except with additional power capability

RoHS compliant

Options for screening in accordance with Mil-PRF-

19500/435 for JAN, JANTX, JANTXV and JANS are

available by adding MQ, MX, MV, or MSP prefixes

respectively to part numbers. For example,

designate MX1PMT4099 for a JANTX (consult factory

for Tin-Lead plating if required).

Optional 100% avionics screening available by

adding MA prefix for 100% temperature cycle,

thermal impedance, and 24 hour HTRB testing

(consult factory for Tin-Lead plating if required).

•

APPLICATIONS / BENEFITS

Extensive selection from 1.8 to 100 V

Regulates voltage over a broad operating current

and temperature range

Low noise density (1-3 kHz) at test current

Low reverse leakage current

Tight tolerances available in plus or minus 2% or 1%

with C or D suffix respectively

Hermetically sealed surface mount package

Nonsensitive to ESD per MIL-STD-750 Method 1020

Compatible with automatic insertion equipment

Full metallic bottom eliminates flux entrapment

•

MAXIMUM RATINGS

•

Operating and Storage Temperatures: -55°C to +150°C

Steady-State Power: 1.0 watt at T

< 120

C where

is case bottom temperature at mounting plane, or

0.5 watts at T

= 30

C (ambient temperature) when

mounted on FR4 PC board as described for thermal

resistance (also see power deratings in Figure 1)

Thermal Resistance: 30°C/W junction to case

(bottom) and 240°C/W junction to ambient on FR4

PC board (1 oz copper) with recommended footprint

(see last page)

Forward voltage: 1.1 Volts @ 200 mA

Solder Temperatures: 260°C for 10 s (max)

•

MECHANICAL AND PACKAGING

CASE: Void-free transfer molded thermosetting epoxy

compound meeting UL94V-0

FINISH: Annealed matte-Tin plating over copper and

readily solderable per MIL-STD-750 method 2026

(consult factory for Tin-Lead plating)

POLARITY: Cathode designated by Tab 1 (bottom)

MARKING: Three numerical digits of P/N and a dot

(see next page listing)

WEIGHT: 0.016 grams (approx.)

Package dimensions on last page

Tape & Reel option: Standard per EIA-481-B

3000 on 7 inch reel and 12,000 on 13” reel

•

1PMT4614-27 &

1PMT4099-4135

2005

5-06-2005 REV G

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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