74AUP1T58GM,132 datasheet, PDF

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74AUP1T58GM,132: Descriptionlogic gates 3V 1G lpow conf; Categorylogic logic; File Size209KB，20 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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logic gates 3V 1G lpow conf

74AUP1T58GM,132 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconduc
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SON
package instruction	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
Contacts	6
Manufacturer packaging code	SOT886
Reach Compliance Code	compli
series	AUP/ULP/V
JESD-30 code	R-PDSO-N6
JESD-609 code	e3
length	1.45 mm
Load capacitance (CL)	30 pF
Logic integrated circuit type	LOGIC CIRCUIT
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of functions	1
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VSON
Encapsulate equivalent code	SOLCC6,.04,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	2.5/3.3 V
Prop。Delay @ Nom-Su	9.4 ns
Certification status	Not Qualified
Schmitt trigger	YES
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	1 mm

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74AUP1T58

Low-power configurable gate with voltage-level translator

Rev. 5 — 15 August 2012

Product data sheet

1. General description

The 74AUP1T58 provides low-power, low-voltage configurable logic gate functions. The

output state is determined by eight patterns of 3-bit input. The user can choose the logic

functions AND, OR, NAND, NOR, XOR, inverter and buffer. All inputs can be connected to

or GND.

This device ensures a very low static and dynamic power consumption across the entire

range from 2.3 V to 3.6 V.

The 74AUP1T58 is designed for logic-level translation applications with input switching

levels that accept 1.8 V low-voltage CMOS signals, while operating from either a single

2.5 V or 3.3 V supply voltage.

The wide supply voltage range ensures normal operation as battery voltage drops from

3.6 V to 2.3 V.

This device is fully specified for partial power-down applications using I

OFF

The I

OFF

circuitry disables the output, preventing the damaging backflow current through

the device when it is powered down.

Schmitt trigger inputs make the circuit tolerant to slower input rise and fall times across

the entire V

range.

2. Features and benefits



Wide supply voltage range from 2.3 V to 3.6 V



High noise immunity



ESD protection:



HBM JESD22-A114F Class 3A exceeds 5000 V



MM JESD22-A115-A exceeds 200 V



CDM JESD22-C101E exceeds 1000 V



Low static power consumption; I

= 1.5

A

(maximum)



Latch-up performance exceeds 100 mA per JESD 78B Class II



Inputs accept voltages up to 3.6 V



Low noise overshoot and undershoot < 10 % of V



OFF

circuitry provides partial power-down mode operation



Multiple package options



Specified from

40 C

to +85

C

and

40 C

to +125

C

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Description	logic gates 3V 1G lpow conf	logic gates config 4.6 V 20 mA	logic gates 3V 1G lpow conf	logic gates 3V 1G lpow conf	logic gates 3V 1G lpow conf	logic gates config 4.6 V 20 mA
Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6	0.90 X 1.00 MM, 0.35 MM HEIGHT, SOT-1115, XSON-6	1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6	PLASTIC, SOT-363, SC-88, PACKAGE-6	1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, XSON-6
Manufacturer packaging code	SOT886	SOT1115	SOT891	SOT886	SOT363	SOT1202
Reach Compliance Code	compli	compli	compli	compli	compli	compli
Parts packaging code	SON	SON	SON	SON	TSSOP	-
Contacts	6	6	6	6	6	-
series	AUP/ULP/V	-	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	-
JESD-30 code	R-PDSO-N6	-	S-PDSO-N6	R-PDSO-N6	R-PDSO-G6	-
JESD-609 code	e3	-	e3	e3	e3	-
length	1.45 mm	-	1 mm	1.45 mm	2 mm	-
Load capacitance (CL)	30 pF	-	30 pF	30 pF	30 pF	-
Logic integrated circuit type	LOGIC CIRCUIT	-	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT	-
MaximumI(ol)	0.004 A	-	0.004 A	0.004 A	0.004 A	-
Humidity sensitivity level	1	-	1	1	1	-
Number of functions	1	-	1	1	1	-
Number of terminals	6	-	6	6	6	-
Maximum operating temperature	125 °C	-	125 °C	125 °C	125 °C	-
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	VSON	-	VSON	VSON	TSSOP	-
Encapsulate equivalent code	SOLCC6,.04,20	-	SOLCC6,.04,14	SOLCC6,.04,20	TSSOP6,.08	-
Package shape	RECTANGULAR	-	SQUARE	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE, VERY THIN PROFILE	-	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-
method of packing	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	-
Peak Reflow Temperature (Celsius)	260	-	260	260	260	-
power supply	2.5/3.3 V	-	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	-
Prop。Delay @ Nom-Su	9.4 ns	-	9.4 ns	9.4 ns	9.4 ns	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-
Schmitt trigger	YES	-	YES	YES	YES	-
Maximum seat height	0.5 mm	-	0.5 mm	0.5 mm	1.1 mm	-
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	-
Minimum supply voltage (Vsup)	2.3 V	-	2.3 V	2.3 V	2.3 V	-
Nominal supply voltage (Vsup)	3 V	-	3 V	3 V	3 V	-
surface mount	YES	-	YES	YES	YES	-
technology	CMOS	-	CMOS	CMOS	CMOS	-
Temperature level	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-
Terminal surface	Tin (Sn)	-	Tin (Sn)	Tin (Sn)	Tin (Sn)	-
Terminal form	NO LEAD	-	NO LEAD	NO LEAD	GULL WING	-
Terminal pitch	0.5 mm	-	0.35 mm	0.5 mm	0.65 mm	-
Terminal location	DUAL	-	DUAL	DUAL	DUAL	-
Maximum time at peak reflow temperature	30	-	30	30	30	-
width	1 mm	-	1 mm	1 mm	1.25 mm	-

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