74AUP1T58GS,132 datasheet, PDF

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74AUP1T58GS,132: Descriptionlogic gates config 4.6 V 20 mA; Categorylogic logic; File Size209KB，20 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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logic gates config 4.6 V 20 mA

74AUP1T58GS,132 Parametric

Parameter Name	Attribute value
Source Url Status Check Date	2013-06-14 00:00:00
Brand Name	NXP Semiconduc
Is it Rohs certified?	conform to
Maker	NXP
package instruction	1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, XSON-6
Manufacturer packaging code	SOT1202
Reach Compliance Code	compli

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74AUP1T58

Low-power configurable gate with voltage-level translator

Rev. 5 — 15 August 2012

Product data sheet

1. General description

The 74AUP1T58 provides low-power, low-voltage configurable logic gate functions. The

output state is determined by eight patterns of 3-bit input. The user can choose the logic

functions AND, OR, NAND, NOR, XOR, inverter and buffer. All inputs can be connected to

or GND.

This device ensures a very low static and dynamic power consumption across the entire

range from 2.3 V to 3.6 V.

The 74AUP1T58 is designed for logic-level translation applications with input switching

levels that accept 1.8 V low-voltage CMOS signals, while operating from either a single

2.5 V or 3.3 V supply voltage.

The wide supply voltage range ensures normal operation as battery voltage drops from

3.6 V to 2.3 V.

This device is fully specified for partial power-down applications using I

OFF

The I

OFF

circuitry disables the output, preventing the damaging backflow current through

the device when it is powered down.

Schmitt trigger inputs make the circuit tolerant to slower input rise and fall times across

the entire V

range.

2. Features and benefits



Wide supply voltage range from 2.3 V to 3.6 V



High noise immunity



ESD protection:



HBM JESD22-A114F Class 3A exceeds 5000 V



MM JESD22-A115-A exceeds 200 V



CDM JESD22-C101E exceeds 1000 V



Low static power consumption; I

= 1.5

A

(maximum)



Latch-up performance exceeds 100 mA per JESD 78B Class II



Inputs accept voltages up to 3.6 V



Low noise overshoot and undershoot < 10 % of V



OFF

circuitry provides partial power-down mode operation



Multiple package options



Specified from

40 C

to +85

C

and

40 C

to +125

C

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Description	logic gates config 4.6 V 20 mA	logic gates config 4.6 V 20 mA	logic gates 3V 1G lpow conf	logic gates 3V 1G lpow conf	logic gates 3V 1G lpow conf	logic gates 3V 1G lpow conf
Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, XSON-6	0.90 X 1.00 MM, 0.35 MM HEIGHT, SOT-1115, XSON-6	1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6	PLASTIC, SOT-363, SC-88, PACKAGE-6
Manufacturer packaging code	SOT1202	SOT1115	SOT891	SOT886	SOT886	SOT363
Reach Compliance Code	compli	compli	compli	compli	compli	compli
Parts packaging code	-	SON	SON	SON	SON	TSSOP
Contacts	-	6	6	6	6	6
series	-	-	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V
JESD-30 code	-	-	S-PDSO-N6	R-PDSO-N6	R-PDSO-N6	R-PDSO-G6
JESD-609 code	-	-	e3	e3	e3	e3
length	-	-	1 mm	1.45 mm	1.45 mm	2 mm
Load capacitance (CL)	-	-	30 pF	30 pF	30 pF	30 pF
Logic integrated circuit type	-	-	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT
MaximumI(ol)	-	-	0.004 A	0.004 A	0.004 A	0.004 A
Humidity sensitivity level	-	-	1	1	1	1
Number of functions	-	-	1	1	1	1
Number of terminals	-	-	6	6	6	6
Maximum operating temperature	-	-	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-	-	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	VSON	VSON	VSON	TSSOP
Encapsulate equivalent code	-	-	SOLCC6,.04,14	SOLCC6,.04,20	SOLCC6,.04,20	TSSOP6,.08
Package shape	-	-	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	-	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	-	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	-	-	260	260	260	260
power supply	-	-	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V
Prop。Delay @ Nom-Su	-	-	9.4 ns	9.4 ns	9.4 ns	9.4 ns
Certification status	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	-	-	YES	YES	YES	YES
Maximum seat height	-	-	0.5 mm	0.5 mm	0.5 mm	1.1 mm
Maximum supply voltage (Vsup)	-	-	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	-	2.3 V	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	-	-	3 V	3 V	3 V	3 V
surface mount	-	-	YES	YES	YES	YES
technology	-	-	CMOS	CMOS	CMOS	CMOS
Temperature level	-	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	-	-	Tin (Sn)	Tin (Sn)	Tin (Sn)	Tin (Sn)
Terminal form	-	-	NO LEAD	NO LEAD	NO LEAD	GULL WING
Terminal pitch	-	-	0.35 mm	0.5 mm	0.5 mm	0.65 mm
Terminal location	-	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	-	30	30	30	30
width	-	-	1 mm	1 mm	1 mm	1.25 mm

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