eeprom 512x8 - 5V rot pin
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Parts packaging code | SOIC |
| package instruction | TSSOP-8 |
| Contacts | 8 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Other features | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES |
| Maximum clock frequency (fCLK) | 3 MHz |
| Data retention time - minimum | 200 |
| Durability | 1000000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e3 |
| length | 4.4 mm |
| memory density | 4096 bi |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 512 words |
| character code | 512 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Serial bus type | SPI |
| Maximum standby current | 0.000005 A |
| Maximum slew rate | 0.005 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 3 mm |
| Maximum write cycle time (tWC) | 5 ms |
| write protect | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
| 25C040X/ST | 25AA040/P | 25LC040X/ST | 25AA040X-I/ST | 25AA040XT/ST | 25AA040/SN | 25AA040X/ST | 25LC040T/SN | |
|---|---|---|---|---|---|---|---|---|
| Description | eeprom 512x8 - 5V rot pin | eeprom 512x8 - 1.8V | eeprom 512x8 - 2.5V rot pin | eeprom 512x8 - 1.8V rot pin | eeprom 512x8 - 1.8V rot pin | eeprom 512x8 - 1.8V | eeprom 512x8 - 1.8V rot pin | eeprom 512x8 - 2.5V |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | SOIC | DIP | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| package instruction | TSSOP-8 | DIP, DIP8,.3 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP-8 | 0.150 INCH, PLASTIC, SOIC-8 | TSSOP-8 | SOP, SOP8,.25 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES |
| Maximum clock frequency (fCLK) | 3 MHz | 1 MHz | 2 MHz | 3 MHz | 1 MHz | 1 MHz | 1 MHz | 2 MHz |
| Data retention time - minimum | 200 | 200 | 200 | 200 | 200 | 200 | 200 | 200 |
| Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| length | 4.4 mm | 9.46 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.9 mm | 4.4 mm | 4.9 mm |
| memory density | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | DIP | TSSOP | TSSOP | TSSOP | SOP | TSSOP | SOP |
| Encapsulate equivalent code | TSSOP8,.25 | DIP8,.3 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | SOP8,.25 | TSSOP8,.25 | SOP8,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | NOT APPLICABLE | 260 | 260 | 260 | 260 | 260 | 260 |
| power supply | 5 V | 2/5 V | 3/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 4.32 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.75 mm | 1.2 mm | 1.75 mm |
| Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| Maximum standby current | 0.000005 A | 0.000002 A | 0.000002 A | 0.000001 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A |
| Maximum slew rate | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 1.8 V | 2.5 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.5 V |
| Nominal supply voltage (Vsup) | 5 V | 1.8 V | 2.5 V | 2.5 V | 1.8 V | 1.8 V | 1.8 V | 2.5 V |
| surface mount | YES | NO | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | NOT APPLICABLE | 40 | 40 | 40 | 40 | 40 | 40 |
| width | 3 mm | 7.62 mm | 3 mm | 3 mm | 3 mm | 3.9 mm | 3 mm | 3.9 mm |
| Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| write protect | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Humidity sensitivity level | 1 | - | 1 | 1 | 1 | 1 | 1 | 3 |
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