25AA040/P datasheet, PDF - EEWORLD Datasheet

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25AA040/P: Descriptioneeprom 512x8 - 1.8V; Categorystorage storage; File Size209KB，23 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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25AA040/P Overview

eeprom 512x8 - 1.8V

25AA040/P Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	6 weeks
Other features	DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES
Maximum clock frequency (fCLK)	1 MHz
Data retention time - minimum	200
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8
JESD-609 code	e3
length	9.46 mm
memory density	4096 bi
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT APPLICABLE
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	4.32 mm
Serial bus type	SPI
Maximum standby current	0.000002 A
Maximum slew rate	0.005 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT APPLICABLE
width	7.62 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

25AA040/P Related Products

	25AA040/P	25LC040X/ST	25AA040X-I/ST	25AA040XT/ST	25AA040/SN	25C040X/ST	25AA040X/ST	25LC040T/SN
Description	eeprom 512x8 - 1.8V	eeprom 512x8 - 2.5V rot pin	eeprom 512x8 - 1.8V rot pin	eeprom 512x8 - 1.8V rot pin	eeprom 512x8 - 1.8V	eeprom 512x8 - 5V rot pin	eeprom 512x8 - 1.8V rot pin	eeprom 512x8 - 2.5V
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	DIP	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	DIP, DIP8,.3	TSSOP, TSSOP8,.25	TSSOP, TSSOP8,.25	TSSOP-8	0.150 INCH, PLASTIC, SOIC-8	TSSOP-8	TSSOP-8	SOP, SOP8,.25
Contacts	8	8	8	8	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Other features	DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES	DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES	DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES	DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES	DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES	DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES	DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES	DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES
Maximum clock frequency (fCLK)	1 MHz	2 MHz	3 MHz	1 MHz	1 MHz	3 MHz	1 MHz	2 MHz
Data retention time - minimum	200	200	200	200	200	200	200	200
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e3	e3	e3	e3	e3	e3	e3	e3
length	9.46 mm	4.4 mm	4.4 mm	4.4 mm	4.9 mm	4.4 mm	4.4 mm	4.9 mm
memory density	4096 bi	4096 bi	4096 bi	4096 bi	4096 bi	4096 bi	4096 bi	4096 bi
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8	8
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	TSSOP	TSSOP	TSSOP	SOP	TSSOP	TSSOP	SOP
Encapsulate equivalent code	DIP8,.3	TSSOP8,.25	TSSOP8,.25	TSSOP8,.25	SOP8,.25	TSSOP8,.25	TSSOP8,.25	SOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT APPLICABLE	260	260	260	260	260	260	260
power supply	2/5 V	3/5 V	2/5 V	2/5 V	2/5 V	5 V	2/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.32 mm	1.2 mm	1.2 mm	1.2 mm	1.75 mm	1.2 mm	1.2 mm	1.75 mm
Serial bus type	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI
Maximum standby current	0.000002 A	0.000002 A	0.000001 A	0.000002 A	0.000002 A	0.000005 A	0.000002 A	0.000002 A
Maximum slew rate	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	2.5 V	1.8 V	1.8 V	1.8 V	4.5 V	1.8 V	2.5 V
Nominal supply voltage (Vsup)	1.8 V	2.5 V	2.5 V	1.8 V	1.8 V	5 V	1.8 V	2.5 V
surface mount	NO	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	0.65 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm	0.65 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT APPLICABLE	40	40	40	40	40	40	40
width	7.62 mm	3 mm	3 mm	3 mm	3.9 mm	3 mm	3 mm	3.9 mm
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
Base Number Matches	1	1	1	1	1	1	1	1
Humidity sensitivity level	-	1	1	1	1	1	1	3

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