EEWORLDEEWORLDEEWORLD

Part Number

Search

CHP1/8502773DLF

Description
Fixed Resistor, Metal Glaze/thick Film, 0.25W, 277000ohm, 200V, 0.5% +/-Tol, 50ppm/Cel,
CategoryPassive components    The resistor   
File Size364KB,4 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

CHP1/8502773DLF Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 277000ohm, 200V, 0.5% +/-Tol, 50ppm/Cel,

CHP1/8502773DLF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid257592783
Reach Compliance Codecompliant
ECCN codeEAR99
structureCylindrical
JESD-609 codee1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package diameter1.45 mm
Package length3.25 mm
Package shapeCYLINDRICAL PACKAGE
Package formMELF
method of packingTR, 7 Inch
Rated power dissipation(P)0.25 W
resistance277000 Ω
Resistor typeFIXED RESISTOR
seriesCHP
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu) - hot dipped
Tolerance0.5%
Operating Voltage200 V
Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
·
0.2 ohm to 2.2 megohm range
·
RoHS-compliant version available
Up to 2 watts
·
150°C maximum operating temperature
Up to 1000 volts
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
Cylindrical High Power
·
Up to 2 watts
·
Surface Mount Metal Glaze
TM
Up to 1000 volts
CHP
Metal Glaze™
thick fi lm element
fi red at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
Solder over
nickel barrier
High
temperature
dielectric
coating
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Maximum
m Change
Maximu
Change
±0.25% +.01 Ω
As specified
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
Test Method
MIL-PRF-55342H, §4.8.3
Test Method
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-PRF-55342H, §4.8.5
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
(-65°C)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
P x R
for 5 seconds
MIL-PRF-55342H, §4.8.7
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
±1%
+ 0.01 ohm
±0.5%
for R>100KΩ
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Resistance to Bonding Exposure
Moisture Resistance
Solderability
High Temperature Exposure
±0.5% +.01 Ω
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
MIL-PRF-55342H, §4.8.8.2
95% minimum coverage
±0.5% + 0.01 ohm
Temperature Coefficient
Life Test
Resistance
Moisture
Life Test
Solderability
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
±1%
+ 0.01
±0.5%
+.01 Ω
ohm
±1% +
minimum coverage
95%
0.01 ohm
no mechanical damage
MIL-PRF-55342H, §4.8.11
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC – defined
Chip mounted in center of 90mm long board, deflected 1mm so as to
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
(no mechanical damage)
exert pull on chip contacts for 5 seconds
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
IRC-defined
±1% +.01 Ω
General Note
Terminal Adhesion Strength (flex)
cation without notice or liability.
Device mounted in center of 90mm long board, deflected 1 mm to exert
IRC reserves the right to make changes in product specifi
(no mechanical damage)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
pull on contacts for 5 seconds
A subsidiary of
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus
Christi Texas
78411 USA
TT electronics plc
General Note
Telephone:
361 992 7900 •
Facsimile:
361 992 3377 •
Website: www.irctt.com
CHP Series
Issue March
2011 Sheet 1 of 3
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
4.14
How to use Labview to perform secondary development on Ginkgo 2
[table=98%] [tr][td]Foreword: Ginkgo 2 supports the development of multiple language platforms, currently supporting C#, C++ Builder, Labwindows/CVI, Python, Qt, VB, VC++ and of course Labview. Below ...
viewtool Embedded System
5. [Learning LPC1768 library functions] 485 experiments
485 (generally known as RS485, EIA-485) is an electrical characteristic of the physical layer of the OSI model, which specifies the standard for 2-wire, half-duplex, multi-point communication. Its ele...
cxmdz NXP MCU
Filter Problems
The signal at the signal input IN is a sine wave (which contains more harmonic components). Remember to filter and follow it and then pass through a passive crystal oscillator. The 8M marked on the fi...
S3S4S5S6 Analog electronics
PCB Design Software Bluetooth Speaker Practice│Physical Rules and Spacing Rules
[align=left][color=rgb(100, 100, 100)][font=myFont, "]The practical operation of PCB design software Allegro Bluetooth speaker case, using Bluetooth speaker as an example to integrate the basic knowle...
ohahaha PCB Design
Arrow&TI live broadcast review: TI FPD-Link III automotive chipset, ideal solution for automotive video transmission
[September 22 live broadcast review and related resources]Live Topic: TI FPD-Link III Automotive Chipset, Ideal Solution for Automotive Video Transmission Live replay: Click to watch Live QA list:Seri...
EEWORLD社区 Automotive Electronics
Leakage current test
Requesting a leakage current test method for a switching power supply! ! [/size][/font][/color] [align=left]Required to meet 120 V; 60 Hz 277 V 60 Hz UL8750 standard[/align]...
A001 Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号