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232276060917

Description
Res,SMT,Thick Film,910m Ohms,200WV,5% +/-Tol,2010 Case
CategoryPassive components    The resistor   
File Size107KB,8 Pages
ManufacturerYAGEO
Websitehttp://www.yageo.com/
Environmental Compliance
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232276060917 Overview

Res,SMT,Thick Film,910m Ohms,200WV,5% +/-Tol,2010 Case

232276060917 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid806482274
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
JESD-609 codee3
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.55 mm
Package length5 mm
Package formSMT
Package width2.5 mm
method of packingTR
Rated power dissipation(P)0.5 W
resistance0.91 Ω
Resistor typeFIXED RESISTOR
series2322 760 60
size code2010
technologyMETAL GLAZE/THICK FILM
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Tolerance5%
Operating Voltage200 V
LOW-OHMIC POWER CHIP RESISTORS
LPRC111
DATA SHEET
5%
size 2010
Product Specification – Jun 23, 2003 V.6

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Description Res,SMT,Thick Film,910m Ohms,200WV,5% +/-Tol,2010 Case Fixed Resistor, Metal Glaze/thick Film, 0.5W, 0.15ohm, 200V, 5% +/-Tol, 2010, Res,SMT,Thick Film,200m Ohms,200WV,5% +/-Tol,2010 Case Fixed Resistor, Metal Glaze/thick Film, 0.5W, 0.24ohm, 200V, 5% +/-Tol, 2010, Res,SMT,Thick Film,270m Ohms,200WV,5% +/-Tol,2010 Case Fixed Resistor, Metal Glaze/thick Film, 0.5W, 0.51ohm, 200V, 5% +/-Tol, 2010, Res,SMT,Thick Film,16m Ohms,200WV,5% +/-Tol,-1500,1500ppm TC,2010 Case Res,SMT,Thick Film,24m Ohms,200WV,5% +/-Tol,-1000,1000ppm TC,2010 Case Fixed Resistor, Metal Glaze/thick Film, 0.5W, 0.091ohm, 200V, 5% +/-Tol, -800,800ppm/Cel, 2010,
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to
Objectid 806482274 806482255 806482258 806482260 806482261 806482268 806482280 806482284 806482298
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
structure Chip Chip Chip Chip Chip Chip Chip Chip Chip
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3 e3
Number of terminals 2 2 2 2 2 2 2 2 2
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package height 0.55 mm 0.55 mm 0.55 mm 0.55 mm 0.55 mm 0.55 mm 2.5 mm 2.5 mm 2.5 mm
Package length 5 mm 5 mm 5 mm 5 mm 5 mm 5 mm 5 mm 5 mm 5 mm
Package form SMT SMT SMT SMT SMT SMT SMT SMT SMT
Package width 2.5 mm 2.5 mm 2.5 mm 2.5 mm 2.5 mm 2.5 mm 2.5 mm 2.5 mm 2.5 mm
method of packing TR TR TR TR TR TR TR TR TR
Rated power dissipation(P) 0.5 W 0.5 W 0.5 W 0.5 W 0.5 W 0.5 W 0.5 W 0.5 W 0.5 W
resistance 0.91 Ω 0.15 Ω 0.2 Ω 0.24 Ω 0.27 Ω 0.51 Ω 0.016 Ω 0.024 Ω 0.091 Ω
Resistor type FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR
series 2322 760 60 2322 760 60 2322 760 60 2322 760 60 2322 760 60 2322 760 60 2322 760 90 2322 760 90 2322 760 90
size code 2010 2010 2010 2010 2010 2010 2010 2010 2010
technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Terminal surface Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Tolerance 5% 5% 5% 5% 5% 5% 5% 5% 5%
Operating Voltage 200 V 200 V 200 V 200 V 200 V 200 V 200 V 200 V 200 V
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