The substrate of chip resistors is alumina. Cracks may occur at the connection of solder (solder fillet portion) due to the difference of the coefficient of thermal expansion from a
mounting board when heat stress like heat cycle, etc. are repeatedly given to them. Care should be taken to the occurrence of the cracks when the change in ambient temperature or
ON /OFF of load is repeated, especially when large types of W2H/W3A which have large thermal expansion and also self heating. By general temperature cycle test using glass-
epoxy(FR-4) boards under the maximum/minimum temperatures of operating temperature range, the crack does not occur easily in the types of 1F〜2E, but the crack tends to
occur in the types of W2H/W3A. The occurrence of the crack by heat stress may be influenced by the size of a pad, solder volume, heat radiation of mounting board etc., so please
pay careful attention to designing when a big change in ambient temperature and conditions for use like ON/OFF of load can be assumed.
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Care should be taken that RK73H1F may be damaged when static electricity occurs and is applied in the equipment.
Problem: After GD32F303 SPI is powered on again, the CLK clock signal IO is not output, but the simulation is normal.My configuration is as follows: Use SPI0, IO remappingFigure 1 This is the normal t...
The DC power supply system is mainly responsible for supplying power to control equipment, protection equipment, etc. in the process of power production. Insulation degradation and DC bus grounding ar...
A new vivado project file was created. At the beginning, it only had uv_calculation and simulation file vtf_uv_calculation.
After simulation, there is no problem with the waveform.
Later, scaler_3to2 ...
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GD32 MCU
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