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LM4990ITL

Description
2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size717KB,19 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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LM4990ITL Overview

2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level

LM4990ITL Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionMICRO SMD-9
Reach Compliance Code_compli
ECCN codeEAR99
Nominal bandwidth20 kHz
Commercial integrated circuit typesAUDIO AMPLIFIER
JESD-30 codeS-PBGA-B9
JESD-609 codee0
length1.463 mm
Humidity sensitivity level1
Number of channels1
Number of functions1
Number of terminals9
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Nominal output power2 W
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA9,3X3,20
Package shapeSQUARE
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply2.6/5 V
Certification statusNot Qualified
Maximum seat height0.675 mm
Maximum slew rate10 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.2 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width1.463 mm

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Description 2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level 2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level 2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level 2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level 2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level 2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level 2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level
Is it Rohs certified? incompatible - incompatible incompatible incompatible incompatible -
Maker National Semiconductor(TI ) - National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) -
package instruction MICRO SMD-9 - MICRO SMD-9 LLP-10 TSSOP-10 MSOP-8 -
Reach Compliance Code _compli - _compli _compli _compli _compli -
ECCN code EAR99 - EAR99 EAR99 EAR99 EAR99 -
Nominal bandwidth 20 kHz - 20 kHz 20 kHz 20 kHz 20 kHz -
Commercial integrated circuit types AUDIO AMPLIFIER - AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER -
JESD-30 code S-PBGA-B9 - S-PBGA-B9 R-XDSO-N10 S-PDSO-G10 S-PDSO-G8 -
JESD-609 code e0 - e0 e0 e0 e0 -
length 1.463 mm - 1.463 mm 4 mm 3 mm 3 mm -
Humidity sensitivity level 1 - 1 1 3 1 -
Number of channels 1 - 1 1 1 1 -
Number of functions 1 - 1 1 1 1 -
Number of terminals 9 - 9 10 10 8 -
Maximum operating temperature 85 °C - 85 °C 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C -40 °C -
Nominal output power 2 W - 2 W 2 W 2 W 2 W -
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code VFBGA - VFBGA HVSON HTSSOP TSSOP -
Encapsulate equivalent code BGA9,3X3,20 - BGA9,3X3,20 SOLCC10,.16,20 TSSOP10,.19,20 TSSOP10,.19,20 -
Package shape SQUARE - SQUARE RECTANGULAR SQUARE SQUARE -
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH - GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH -
Peak Reflow Temperature (Celsius) 260 - 260 235 260 260 -
power supply 2.6/5 V - 2.6/5 V 2.6/5 V 2.6/5 V 2.6/5 V -
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 0.675 mm - 0.675 mm 0.8 mm 1.1 mm 1.09 mm -
Maximum slew rate 10 mA - 10 mA 10 mA 10 mA 10 mA -
Maximum supply voltage (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage (Vsup) 2.2 V - 2.2 V 2.2 V 2.2 V 2.2 V -
surface mount YES - YES YES YES YES -
Temperature level INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface Tin/Lead (Sn63Pb37) - Tin/Lead (Sn63Pb37) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form BALL - BALL NO LEAD GULL WING GULL WING -
Terminal pitch 0.5 mm - 0.5 mm 0.5 mm 0.5 mm 0.65 mm -
Terminal location BOTTOM - BOTTOM DUAL DUAL DUAL -
Maximum time at peak reflow temperature 40 - 40 30 40 40 -
width 1.463 mm - 1.463 mm 3 mm 3 mm 3 mm -
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