|
SPB10N10 |
SPP10N10 |
SPI10N10 |
SPB10N10 G |
Description |
10.3 A, 100 V, 0.17 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-262AA |
10.3 A, 100 V, 0.17 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-262AA |
10.3 A, 100 V, 0.17 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-262AA |
MOSFET N-CH 100V 10.3A D2PAK |
Is it Rohs certified? |
incompatible |
conform to |
conform to |
- |
Maker |
Infineon |
Infineon |
Infineon |
- |
Parts packaging code |
D2PAK |
TO-262AA |
TO-220AB |
- |
package instruction |
PLASTIC, TO-263, 3 PIN |
FLANGE MOUNT, R-PSFM-T3 |
FLANGE MOUNT, R-PSFM-T3 |
- |
Contacts |
4 |
3 |
3 |
- |
Reach Compliance Code |
_compli |
unknown |
compli |
- |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
- |
Other features |
AVALANCHE RATED |
AVALANCE RATED |
AVALANCHE RATED |
- |
Avalanche Energy Efficiency Rating (Eas) |
60 mJ |
60 mJ |
60 mJ |
- |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
- |
Minimum drain-source breakdown voltage |
100 V |
100 V |
100 V |
- |
Maximum drain current (Abs) (ID) |
10.3 A |
10.3 A |
10.3 A |
- |
Maximum drain current (ID) |
10.3 A |
10.3 A |
10.3 A |
- |
Maximum drain-source on-resistance |
0.17 Ω |
0.17 Ω |
0.17 Ω |
- |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
- |
JEDEC-95 code |
TO-263AB |
TO-220AB |
TO-220AB |
- |
JESD-30 code |
R-PSSO-G2 |
R-PSFM-T3 |
R-PSFM-T3 |
- |
JESD-609 code |
e0 |
e3 |
e3 |
- |
Number of components |
1 |
1 |
1 |
- |
Number of terminals |
2 |
3 |
3 |
- |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
- |
Maximum operating temperature |
175 °C |
175 °C |
175 °C |
- |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
Package form |
SMALL OUTLINE |
FLANGE MOUNT |
FLANGE MOUNT |
- |
Peak Reflow Temperature (Celsius) |
220 |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
- |
Maximum power dissipation(Abs) |
50 W |
50 W |
50 W |
- |
Maximum pulsed drain current (IDM) |
41.2 A |
41.2 A |
41.2 A |
- |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
surface mount |
YES |
NO |
NO |
- |
Terminal surface |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) |
Matte Tin (Sn) |
- |
Terminal form |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
- |
Terminal location |
SINGLE |
SINGLE |
SINGLE |
- |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Transistor component materials |
SILICON |
SILICON |
SILICON |
- |