XSFP10821501B datasheet, PDF - EEWORLD Datasheet

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XSFP10821501B: DescriptionRES,SMT,THIN FILM,21.5K OHMS,100WV,.1% +/-TOL,-25,25PPM TC,0202 CASE; CategoryPassive components The resistor; File Size84KB，3 Pages; ManufacturerVishay; Websitehttp://www.vishay.com

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XSFP10821501B Overview

RES,SMT,THIN FILM,21.5K OHMS,100WV,.1% +/-TOL,-25,25PPM TC,0202 CASE

XSFP10821501B Parametric

Parameter Name	Attribute value
Objectid	1220429045
package instruction	SMT, 0202
Reach Compliance Code	unknown
Country Of Origin	USA
ECCN code	EAR99
YTEOL	8.5
structure	Chip
Manufacturer's serial number	SFP
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package height	0.254 mm
Package length	0.558 mm
Package form	SMT
Package width	0.558 mm
method of packing	Tray
Rated power dissipation(P)	0.25 W
Guideline	MIL-STD-883
resistance	21500 Ω
Resistor type	FIXED RESISTOR
series	SFP
size code	0202
technology	THIN FILM
Temperature Coefficient	25 ppm/°C
Tolerance	0.1%
Operating Voltage	100 V

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SFP

Vishay Electro-Films

CHIP

RESISTORS

Thin Film Top-Contact Resistor

with Part Mark

FEATURES

•

Wire bondable

Product may not

be to scale

•

Part marked - 5 digits

•

Small size: 0.022 inches square

•

Resistance range: 1

to 1 MΩ

•

DC power rating: 250 mW

•

Oxidized silicon substrate for good power dissipation

•

Resistor material: Tantalum nitride, self passivating

•

Moisture resistant

The SFP series single-value resistor chips offer a small size,

wide ohmic value range and excellent power capacity.

The SFPs are part marked with resistance value allowing

user the ability to visually determine the resistance value of

the chip.

The SFPs are manufactured using Vishay Electro-Films

(EFI) sophisticated thin film equipment and manufacturing

technology.

The SFPs are 100 % electrically tested and visually

inspected to MIL-STD-883.

APPLICATIONS

Vishay EFI SFP small resistor chips are widely used in hybrid packages where space is limited and chip value marking is

important for identification. The die is part marked with the resistance value. Wire bonding is made to the two pads on the top of

the chip.

TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES

Tightest Standard Tolerance Available

0.5 %

PROCESS CODE

0.1 %

± 25 ppm/°C

± 50 ppm/°C

± 100 ppm/°C

± 250 ppm/°C

CLASS H*

103

102

101

100

CLASS K*

108

107

106

105

100

200 k

430 k

620 k

1 M

* MIL-PRF-38534 inspection criteria

STANDARD ELECTRICAL SPECIFICATIONS

PARAMETER

Noise, MIL-STD-202, Method 308

100

- 250 kΩ

< 100

or > 251 kΩ

Moisture Resistance, MIL-STD-202

Method 106

Stability, 1000 h, + 125 °C, 125 mW

Operating Temperature Range

Thermal Shock, MIL-STD-202,

Method 107, Test Condition F

High Temperature Exposure, + 150 °C, 100 h

Dielectric Voltage Breakdown

Insulation Resistance

Operating Voltage

DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)

5 x Rated Power Short-Time Overload, + 25 °C, 5 s

Values above 1M available

www.vishay.com

For technical questions, contact: ff2bresistors@vishay.com

Document Number: 61000

Revision: 07-Mar-08

- 35 dB typ.

- 20 dB typ.

± 0.5 % max.

ΔR/R

± 0.25 % max.

ΔR/R

- 55 °C to + 125 °C

± 0.25 % max.

ΔR/R

± 0.5 % max.

ΔR/R

200 V

min.

100 V max.

250 mW

± 0.25 % max.

ΔR/R

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