Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
This article mainly describes the use of the Zero-Knowledge ESP8266 development board and the six-axis sensor (three-axis gyroscope + three-axis acceleration)I. HardwareZero-Knowledge ESP8266 developm...
[i=s]This post was last edited by a736015 on 2019-12-9 10:35[/i]IWR1443BOOST unboxing test: https://en.eeworld.com/bbs/thread-1101610-1-1.html
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Driver for 25C256 (EEPROM) based on SPI interface of AVR microcontroller
/**************************************Hardware macro definition************************************/
#define SelectMemory1()...[Details]
Analog electronics
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