Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
[i=s]This post was last edited by zhang520 on 2021-10-21 15:08[/i]Error[Li006]: duplicate definitions for "_interrupt_21"; Change 21 to 20 and the system will run fine...
[i=s]This post was last edited by symic on 2022-3-20 19:42[/i]I am very happy and surprised to get the opportunity to review the BearPi-HM Nano development board. Thanks to Nanjing BearPi Intelligent ...
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