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Selection summary of mainstream Bluetooth BLE MESH module Bluetooth chip IC [Copy link]

1. Introduction

Since the launch of the BLE Bluetooth mesh protocol stack, it has been attracting the attention of many developers. However, the application ecosystem is very scarce now, so the source manufacturers of chips are not very strong, and there are only a few manufacturers to maintain it. However, with the rapid development of the Internet of Things and the gradual implementation of AI, I believe that Bluetooth mesh will definitely trigger a new market in the near future and bring a brand new

2. Classification of Bluetooth

Here, I won’t explain the Bluetooth version in detail, because it can be easily searched on the Internet. Here, I personally think that Bluetooth classification is mainly divided into five categories:

Bluetooth Classification

Application Scenario

trend

Bluetooth audio chip

1. Bluetooth speakers [portable Bluetooth speakers], [desktop Bluetooth speakers], [square dance speakers]

2. Bluetooth headsets [sports Bluetooth headsets], [head-mounted Bluetooth headsets]

3. There are also SPP transparent transmission modules developed using this chip in the early days, such as HC-05, which are on the verge of being eliminated.

You can only understand, but not make products. This category mainly focuses on Bluetooth speakers and Bluetooth headsets

Bluetooth BLE Solution

1. Smart bracelet

2. Bluetooth unlocking for shared bicycles

3. Smart adult products, smart lights

4. Application of Bluetooth data transmission in industry

Imports, and ongoing costs are high

Bluetooth data transmission solution, dual-mode BLE and SPP

1. Vehicle OBD data transmission

2. Bluetooth printer products

Niche applications, high cost

Bluetooth audio + dual-mode data

1. This is the current main product. Due to the huge shipment volume, the cost of chips has been rapidly reduced.

2. Overall, the chip cost of this part is the lowest because it has the most application scenarios.

3. The advantages are low cost, flexible development, support for BLE and SPP, and audio

4. The disadvantages are also obvious. Because it is compatible with audio, it consumes a lot of power and is not suitable for making some low-power products, so it is out of the question for bracelets.

This is the largest market with the most competition.

You can follow

Bluetooth MESH

1. The most obvious thing to think of is home lighting

2. Hotel broadcast calling system--KT6039A

3. Remote meter reading system 2491352264

4. Suitable for any scenario requiring low power consumption and self-organizing network

Domestic efforts. Focus on

3. Some pain points and hopes of Bluetooth MESH at present

Current pain points of Bluetooth MESH

1. Since the protocol stack of Bluetooth MESH is very complex, at least 3 times more complex than BLE and Bluetooth audio, it is very difficult to develop. It is basically unrealistic for individuals to develop it, so it can only be promoted by chip manufacturers.

2. Since there are relatively few chip manufacturers involved, the cost of Bluetooth mesh chips remains high. As a result, the MESH modules developed by some module manufacturers are also expensive, which is not conducive to the acceptance of terminal consumers.

3. At present, the application scenarios are also being gradually improved, for example, the addition of AI. This is a highlight. Tmall Genie has been connected with Tailing Micro, so that Tmall Genie can directly command the Bluetooth module to complete some control or data interaction, which is very interesting.

The hope of Bluetooth MESH

1. Fortunately, with the enrichment of application scenarios, many domestic chip manufacturers have begun to pay attention to it, which means that Bluetooth mesh will no longer be high and mighty. The author predicts that the ecosystem will explode in 2020. Because the improvement of cost and performance will definitely bring about many product innovations and

2. Currently, only Bluetooth mesh and Zigbee are promising wireless technologies that can form a self-organizing network. Other technologies have been eliminated. Zigbee cannot communicate with mobile phones, which will severely limit its development. At the same time, the high cost will also be a big obstacle.

3. Unlike Zigbee, Bluetooth mesh has two biggest advantages:

(1) It can be interconnected with mobile phones and is also a standard protocol, and can be connected to the AI system [KT6039A]

(2) Relying on massive shipments, costs can be reduced rapidly, and fierce competition will definitely benefit consumers.

KT6039A is a low-cost Bluetooth mesh chip that integrates the Bluetooth mesh protocol stack. Users do not need to worry about complex protocols, they only need to use serial port transparent transmission.

4. Summary of selection

Although there are many options, the selection is a critical link that cannot be ignored.

Because the result of the selection will affect the cost-effectiveness of the entire product, as well as a series of issues such as the development cycle, so here we have made some systematic classifications to help engineers choose the most appropriate solution to develop advantageous products.

This post is from RF/Wirelessly

Latest reply

Chengdu SYDTEK Technology Co., Ltd. ( SYDTEK ) was established in March 2018 (its predecessor , Beijing Shengyuanda Technology Co., Ltd., was established in February 2012 ) . The team is composed of overseas returnees with rich experience in wireless communication chip design. The team members mainly come from Tsinghua University, University of Electronic Science and Technology of China and other institutions. The company is engaged in the design, development and sales of ultra-low power IoT wireless connection and security computing chips. Products include: SYD88 series ultra-low power IoT BLE system chips Chip, SYD32 series IoT MCU chip. Chengdu SYDTEK has R&D centers in Chengdu and Hsinchu, Taiwan, and technical support and sales centers in Shenzhen. Chengdu SYDTEK has been working closely with many enterprises in the field of ultra-low power We have deep technical accumulation in the field of IoT chips, and have developed the world's lowest power consumption and highest performance BLE IoT chip SYD8821 , as well as the world's highest cost-effective The low-power BLE chips SYD8811 and SYD8810 contribute to the development of Chinese chips. Chengdu Shengxin Micro Technology Co., Ltd. is committed to becoming a leader in ultra-low power IoT BLE and wireless MCU chips !   Details Published on 2019-9-3 17:19
 

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It's just an introduction to the chip.

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Is there any more detailed information about mesh?

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Chengdu SYDTEK Technology Co., Ltd. ( SYDTEK ) was established in March 2018 (its predecessor , Beijing Shengyuanda Technology Co., Ltd., was established in February 2012 ) .
The team is composed of overseas returnees with rich experience in wireless communication chip design. The team members mainly come from Tsinghua University, University of Electronic Science and Technology of China and other institutions.
The company is engaged in the design, development and sales of ultra-low power IoT wireless connection and security computing chips. Products include: SYD88 series ultra-low power IoT BLE system chips
Chip, SYD32 series IoT MCU chip.
Chengdu SYDTEK has R&D centers in Chengdu and Hsinchu, Taiwan, and technical support and sales centers in Shenzhen.
Chengdu SYDTEK has been working closely with many enterprises in the field of ultra-low power
We have deep technical accumulation in the field of IoT chips, and have developed the world's lowest power consumption and highest performance BLE IoT chip SYD8821 , as well as the world's highest cost-effective
The low-power BLE chips SYD8811 and SYD8810 contribute to the development of Chinese chips.
Chengdu Shengxin Micro Technology Co., Ltd. is committed to becoming a leader in ultra-low power IoT BLE and wireless MCU chips !
This post is from RF/Wirelessly
 
 
 

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