Microcontroller, 8-Bit, MROM, 24MHz, CMOS, PQFP44, PLASTIC, QFP-44
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | QFP |
| package instruction | QFP, |
| Contacts | 44 |
| Reach Compliance Code | compli |
| Has ADC | NO |
| Address bus width | 16 |
| bit size | 8 |
| maximum clock frequency | 24 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| JESD-30 code | S-PQFP-G44 |
| JESD-609 code | e0 |
| Number of I/O lines | 32 |
| Number of terminals | 44 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| ROM programmability | MROM |
| speed | 24 MHz |
| Maximum slew rate | 38 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| IS80C51PQ | IS80C51PL | IS80C31W | IS80C31PQ | IS80C51W | |
|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, 24MHz, CMOS, PQFP44, PLASTIC, QFP-44 | Microcontroller, 8-Bit, MROM, 24MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, 24MHz, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | Microcontroller, 8-Bit, 24MHz, CMOS, PQFP44, PLASTIC, QFP-44 | Microcontroller, 8-Bit, MROM, 24MHz, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | QFP | LCC | DIP | QFP | DIP |
| package instruction | QFP, | PLASTIC, LCC-44 | DIP, | QFP, | 0.600 INCH, PLASTIC, DIP-40 |
| Contacts | 44 | 44 | 40 | 44 | 40 |
| Reach Compliance Code | compli | compliant | compliant | compliant | compliant |
| Has ADC | NO | NO | NO | NO | NO |
| Address bus width | 16 | 16 | 16 | 16 | 16 |
| bit size | 8 | 8 | 8 | 8 | 8 |
| maximum clock frequency | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
| DAC channel | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO |
| External data bus width | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | S-PQFP-G44 | S-PQCC-J44 | R-PDIP-T40 | S-PQFP-G44 | R-PDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Number of I/O lines | 32 | 32 | 32 | 32 | 32 |
| Number of terminals | 44 | 44 | 40 | 44 | 40 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| PWM channel | NO | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QCCJ | DIP | QFP | DIP |
| Package shape | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| speed | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
| Maximum slew rate | 38 mA | 38 mA | 38 mA | 38 mA | 38 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| surface mount | YES | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal location | QUAD | QUAD | DUAL | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| ROM programmability | MROM | MROM | - | - | MROM |
| length | - | 16.5862 mm | 52.07 mm | - | 52.07 mm |
| Maximum seat height | - | 4.57 mm | 5.08 mm | - | 5.08 mm |
| Terminal pitch | - | 1.27 mm | 2.54 mm | - | 2.54 mm |
| width | - | 16.5862 mm | 15.24 mm | - | 15.24 mm |
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