Analog Circuit, Hybrid, MDSO9,
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | C&D |
package instruction | SOP, GWDIP9,2.2,300/200 |
Reach Compliance Code | unknown |
Maximum input voltage | 5.5 V |
Minimum input voltage | 4.75 V |
JESD-30 code | R-MDSO-G9 |
Number of terminals | 9 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -40 °C |
Maximum output current | 3 A |
Nominal output voltage | 3.3 V |
Package body material | METAL |
encapsulated code | SOP |
Encapsulate equivalent code | GWDIP9,2.2,300/200 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Certification status | Not Qualified |
surface mount | YES |
technology | HYBRID |
Temperature level | OTHER |
Terminal form | GULL WING |
Terminal pitch | 5.08 mm |
Terminal location | DUAL |
UNR-3.3/3-D5SM-C | UNR-1.8/2-D5-C | UNR-1.8/2-D5SM-C | UNR-2.5/2-D5SM-C | UNR-3.3/3-D5-C | UNR-3.3/3-D12-C | UNR-2.5/2-D5-C | |
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Description | Analog Circuit, Hybrid, MDSO9, | Analog Circuit, Hybrid, | Analog Circuit, Hybrid, MDSO9, | Analog Circuit, Hybrid, MDSO9, | Analog Circuit, Hybrid, | Analog Circuit, Hybrid, | Analog Circuit, Hybrid, |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
package instruction | SOP, GWDIP9,2.2,300/200 | , MODULE,6LEAD,0.8 | SOP, GWDIP9,2.2,300/200 | SOP, GWDIP9,2.2,300/200 | , MODULE,6LEAD,0.8 | , MODULE,6LEAD,0.8 | , MODULE,6LEAD,0.8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum input voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 13.6 V | 5.5 V |
Minimum input voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 10.8 V | 4.75 V |
Number of terminals | 9 | 6 | 9 | 9 | 6 | 6 | 6 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Maximum output current | 3 A | 2 A | 2 A | 2 A | 3 A | 3 A | 2 A |
Nominal output voltage | 3.3 V | 1.8 V | 1.8 V | 2.5 V | 3.3 V | 3.3 V | 2.5 V |
Package body material | METAL | PLASTIC/EPOXY | METAL | METAL | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Encapsulate equivalent code | GWDIP9,2.2,300/200 | MODULE,6LEAD,0.8 | GWDIP9,2.2,300/200 | GWDIP9,2.2,300/200 | MODULE,6LEAD,0.8 | MODULE,6LEAD,0.8 | MODULE,6LEAD,0.8 |
Package form | SMALL OUTLINE | MICROELECTRONIC ASSEMBLY | SMALL OUTLINE | SMALL OUTLINE | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
technology | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
Maker | C&D | - | C&D | C&D | C&D | C&D | C&D |