MR1A16AMA35 datasheet, PDF - EEWORLD Datasheet

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MR1A16AMA35: DescriptionMemory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48; Categorystorage storage; File Size2MB，14 Pages; ManufacturerEverspin Technologies; Environmental Compliance

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MR1A16AMA35 Overview

Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48

MR1A16AMA35 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Everspin Technologies
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	48
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-30 code	S-PBGA-B48
length	8 mm
memory density	2097152 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	48
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.35 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	8 mm

MR1A16AMA35 Related Products

	MR1A16AMA35	MR1A16ACMA35	MR1A16ACYS35	MR1A16ACYS35R	MR1A16AVYS35	MR1A16AVYS35R	MR1A16AVMA35	MR1A16AYS35	MR1A16AYS35R
Description	Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	BGA	TSOP2	TSOP2	TSOP2	TSOP2	BGA	TSOP2	TSOP2
package instruction	LFBGA,	LFBGA,	TSOP2, TSOP44,.46,32	TSOP2,	TSOP2, TSOP44,.46,32	TSOP2,	LFBGA,	TSOP2, TSOP44,.46,32	TSOP2,
Contacts	48	48	44	44	44	44	48	44	44
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	S-PBGA-B48	S-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	S-PBGA-B48	R-PDSO-G44	R-PDSO-G44
length	8 mm	8 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	8 mm	18.41 mm	18.41 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	48	48	44	44	44	44	48	44	44
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	85 °C	85 °C	105 °C	105 °C	105 °C	70 °C	70 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-
organize	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	TSOP2	TSOP2	TSOP2	TSOP2	LFBGA	TSOP2	TSOP2
Package shape	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	NOT SPECIFIED	260	NOT SPECIFIED	260	260	NOT SPECIFIED	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.35 mm	1.35 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.35 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	GULL WING	GULL WING	GULL WING	GULL WING	BALL	GULL WING	GULL WING
Terminal pitch	0.75 mm	0.75 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.75 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	DUAL	DUAL	DUAL	DUAL	BOTTOM	DUAL	DUAL
Maximum time at peak reflow temperature	40	40	NOT SPECIFIED	40	NOT SPECIFIED	40	40	NOT SPECIFIED	40
width	8 mm	8 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	8 mm	10.16 mm	10.16 mm
Maker	Everspin Technologies	-	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies

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