MR1A16ACYS35R datasheet, PDF - EEWORLD Datasheet

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MR1A16ACYS35R: DescriptionMemory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44; Categorystorage storage; File Size2MB，14 Pages; ManufacturerEverspin Technologies; Environmental Compliance

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MR1A16ACYS35R Overview

Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44

MR1A16ACYS35R Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Everspin Technologies
Parts packaging code	TSOP2
package instruction	TSOP2,
Contacts	44
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-30 code	R-PDSO-G44
length	18.41 mm
memory density	2097152 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	44
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	10.16 mm

MR1A16ACYS35R Related Products

	MR1A16ACYS35R	MR1A16ACMA35	MR1A16ACYS35	MR1A16AVYS35	MR1A16AVYS35R	MR1A16AVMA35	MR1A16AYS35	MR1A16AYS35R	MR1A16AMA35
Description	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	TSOP2	BGA	TSOP2	TSOP2	TSOP2	BGA	TSOP2	TSOP2	BGA
package instruction	TSOP2,	LFBGA,	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32	TSOP2,	LFBGA,	TSOP2, TSOP44,.46,32	TSOP2,	LFBGA,
Contacts	44	48	44	44	44	48	44	44	48
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-PDSO-G44	S-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	S-PBGA-B48	R-PDSO-G44	R-PDSO-G44	S-PBGA-B48
length	18.41 mm	8 mm	18.41 mm	18.41 mm	18.41 mm	8 mm	18.41 mm	18.41 mm	8 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	44	48	44	44	44	48	44	44	48
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	105 °C	105 °C	105 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-
organize	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	LFBGA	TSOP2	TSOP2	TSOP2	LFBGA	TSOP2	TSOP2	LFBGA
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	NOT SPECIFIED	NOT SPECIFIED	260	260	NOT SPECIFIED	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.35 mm	1.2 mm	1.2 mm	1.2 mm	1.35 mm	1.2 mm	1.2 mm	1.35 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	BALL	GULL WING	GULL WING	GULL WING	BALL	GULL WING	GULL WING	BALL
Terminal pitch	0.8 mm	0.75 mm	0.8 mm	0.8 mm	0.8 mm	0.75 mm	0.8 mm	0.8 mm	0.75 mm
Terminal location	DUAL	BOTTOM	DUAL	DUAL	DUAL	BOTTOM	DUAL	DUAL	BOTTOM
Maximum time at peak reflow temperature	40	40	NOT SPECIFIED	NOT SPECIFIED	40	40	NOT SPECIFIED	40	40
width	10.16 mm	8 mm	10.16 mm	10.16 mm	10.16 mm	8 mm	10.16 mm	10.16 mm	8 mm
Maker	Everspin Technologies	-	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies

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