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MR1A16AVYS35

Description
Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44
Categorystorage    storage   
File Size2MB,14 Pages
ManufacturerEverspin Technologies
Environmental Compliance
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MR1A16AVYS35 Overview

Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44

MR1A16AVYS35 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerEverspin Technologies
Parts packaging codeTSOP2
package instructionTSOP2, TSOP44,.46,32
Contacts44
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time35 ns
JESD-30 codeR-PDSO-G44
length18.41 mm
memory density2097152 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals44
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
organize128KX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP44,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.028 A
Maximum slew rate0.165 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm

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MR1A16AVYS35 MR1A16ACMA35 MR1A16ACYS35 MR1A16ACYS35R MR1A16AVYS35R MR1A16AVMA35 MR1A16AYS35 MR1A16AYS35R MR1A16AMA35
Description Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48 Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48 Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to
Parts packaging code TSOP2 BGA TSOP2 TSOP2 TSOP2 BGA TSOP2 TSOP2 BGA
package instruction TSOP2, TSOP44,.46,32 LFBGA, TSOP2, TSOP44,.46,32 TSOP2, TSOP2, LFBGA, TSOP2, TSOP44,.46,32 TSOP2, LFBGA,
Contacts 44 48 44 44 44 48 44 44 48
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 code R-PDSO-G44 S-PBGA-B48 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 S-PBGA-B48 R-PDSO-G44 R-PDSO-G44 S-PBGA-B48
length 18.41 mm 8 mm 18.41 mm 18.41 mm 18.41 mm 8 mm 18.41 mm 18.41 mm 8 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
memory width 16 16 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 44 48 44 44 44 48 44 44 48
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 105 °C 85 °C 85 °C 85 °C 105 °C 105 °C 70 °C 70 °C 70 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C - - -
organize 128KX16 128KX16 128KX16 128KX16 128KX16 128KX16 128KX16 128KX16 128KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 LFBGA TSOP2 TSOP2 TSOP2 LFBGA TSOP2 TSOP2 LFBGA
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR SQUARE
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 NOT SPECIFIED 260 260 260 NOT SPECIFIED 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.35 mm 1.2 mm 1.2 mm 1.2 mm 1.35 mm 1.2 mm 1.2 mm 1.35 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING BALL GULL WING GULL WING GULL WING BALL GULL WING GULL WING BALL
Terminal pitch 0.8 mm 0.75 mm 0.8 mm 0.8 mm 0.8 mm 0.75 mm 0.8 mm 0.8 mm 0.75 mm
Terminal location DUAL BOTTOM DUAL DUAL DUAL BOTTOM DUAL DUAL BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 40 NOT SPECIFIED 40 40 40 NOT SPECIFIED 40 40
width 10.16 mm 8 mm 10.16 mm 10.16 mm 10.16 mm 8 mm 10.16 mm 10.16 mm 8 mm
Maker Everspin Technologies - Everspin Technologies Everspin Technologies Everspin Technologies Everspin Technologies Everspin Technologies Everspin Technologies Everspin Technologies

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