Flash Module, 4MX8, 150ns, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | White Electronic Designs Corporation |
package instruction | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 150 ns |
Other features | CONFIGURABLE AS 1M X 32 |
Data polling | NO |
JESD-30 code | S-CPGA-P66 |
JESD-609 code | e0 |
length | 35.2 mm |
memory density | 33554432 bit |
Memory IC Type | FLASH MODULE |
memory width | 8 |
Number of functions | 1 |
Number of departments/size | 32 |
Number of terminals | 66 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX8 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Encapsulate equivalent code | PGA66,11X11 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Programming voltage | 12 V |
Certification status | Not Qualified |
Maximum seat height | 5.7 mm |
Department size | 32K |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.2 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | NO |
type | NOR TYPE |
width | 35.2 mm |