MN102H74D, MN102H74G
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
64K
4K
LQFP100-P-1414
[With main clock operated]
83.3
ns (at
3.0
V to
3.6
V,
12
MHz)
MN102H74D
Mask ROM
128K
MN102H74G
MN102HF74G
FLASH
Interrupts
/RST pin, Watchdog, /NMI pin, Timer counter
0
to
9
underflow, Timer counter
10
to
13
under/o Verflow, Timer counter
10
to
13
compare capture A, Timer counter
10
to
13
compare capture B, ATC ch.0 to ch.3 tra nsfer finish, External
0
to
5,
Serial ch.0 to ch.3
tra nsmission, Serial ch.0 to ch.3 reception, A/D conversion finish, USB general-purpose, USBSOF, USB end points
1
to
8
Timer counter
0
:
8-bit
×
1
(timer output, event count, timer interrupt)
Clock source................ SYSCLK; XI; prescaler
0;
TM0IO pin
Interrupt source ........... Timer counter
0
underflow
Timer counter
1
:
8-bit
×
1
(timer output, event count, timer interrupt)
Clock source................ SYSCLK; prescaler
0;
TM1IO pin
Interrupt source ........... Timer counter
1
underflow
Connectable Timer counters
0
to
1
Timer counter
2
:
8-bit
×
1
(timer output, event count, timer interrupt, A/D conversion start)
Clock source................ SYSCLK;
1/8
of SYSCLK;
1/32
of SYSCLK; timer counter
3
underflow; timer counter
4
underflow;
TM2IO pin
Interrupt source ........... Timer counter
2
underflow
Timer counter
3
:
8-bit
×
1
(timer output, event count, timer interrupt)
Clock source................ SYSCLK;
1/8
of SYSCLK;
1/32
of SYSCLK; timer counter
2
underflow; timer counter
4
underflow;
TM3IO pin
Interrupt source ........... Timer counter
3
underflow
Timer counter
4
:
8-bit
×
1
(timer output, event count, timer interrupt)
Clock source................ SYSCLK;
1/8
of SYSCLK;
1/32
of SYSCLK; timer counter
2
underflow; timer counter
3
underflow;
TM4IO pin
Interrupt source ........... Timer counter
4
underflow
Timer counter
5
:
8-bit
×
1
(timer output, event count, timer interrupt)
Clock source................ SYSCLK;
1/8
of SYSCLK;
1/32
of SYSCLK; timer counter
2
underflow; timer counter
3
underflow;
timer counter
4
underflow; TM5IO pin
Interrupt source ........... Timer counter
5
underflow
Connectable Timer counters
2
to
5
Timer counter
6
:
8-bit
×
1
(timer output, event count, timer interrupt, serial clock generation)
Clock source................ SYSCLK;
1/8
of SYSCLK;
1/32
of SYSCLK; timer counter
7
underflow; timer counter
8
underflow;
TM6IO pin
Interrupt source ........... Timer counter
6
underflow
Timer counter
7
:
8-bit
×
1
(timer output, event count, timer interrupt, serial clock generation)
Clock source................ SYSCLK;
1/8
of SYSCLK;
1/32
of SYSCLK; timer counter
6
underflow; timer counter
8
underflow;
TM7IO pin
Interrupt source ........... Timer counter
7
underflow
Timer Counter
MAE00011GEM
MN102H74D, MN102H74G
Timer counter
8
:
8-bit
×
1
(timer output, event count, timer interrupt, serial clock generation)
Clock source................ SYSCLK;
1/8
of SYSCLK;
1/32
of SYSCLK; timer counter
6
underflow; timer counter
7
underflow;
TM8IO pin
Interrupt source ........... Timer counter
8
underflow
Timer counter
9
:
8-bit
×
1
(timer output, event count, timer interrupt)
Clock source................ SYSCLK;
1/8
of SYSCLK;
1/32
of SYSCLK; timer counter
6
underflow; timer counter
7
underflow;
timer counter
8
underflow; TM9IO pin
Interrupt source ........... Timer counter
9
underflow
Connectable Timer counters
6
to
9
Timer counter
10
:
16-bit
×
1
(timer output, event count, input capture, PWM output,
2-phase
encoder input)
Clock source................ SYSCLK;
1/8
of SYSCLK; timer counter
2
or
3
underflow;
2-phase
encoding of TM10IOA/TM10IOB
pin (1
×
,
4
×
); TM10IOB pin
Interrupt source ........... Timer counter
10
under/overflow; timer counter
10
compare capture A; timer counter
10
compare capture
B
Timer counter
11
:
16-bit
×
1
(timer output, event count, input capture, PWM output,
2-phase
encoder input)
Clock source................ SYSCLK;
1/8
of SYSCLK; timer counter
8
or
9
underflow;
2-phase
encoding of TM11IOA/TM11IOB
pin (1
×
,
4
×
); TM11IOB pin
Interrupt source ........... Timer counter
11
under/overflow; timer counter
11
compare capture A; timer counter
11
compare capture
B
Timer counter
12
:
16-bit
×
1
(timer output, event count, input capture, PWM output,
2-phase
encoder input)
Clock source................ SYSCLK;
1/8
of SYSCLK; timer counter
4
or
5
underflow;
2-phase
encoding of TM12IOA/TM12IOB
pin (1
×
,
4
×
); TM12IOB pin
Interrupt source ........... Timer counter
12
under/overflow; timer counter
12
compare capture A; timer counter
12
compare capture
B
Timer counter
13
:
16-bit
×
1
(timer output, event count, input capture, PWM output,
2-phase
encoder input)
Clock source................ SYSCLK;
1/8
of SYSCLK; timer counter
6
or
7
underflow;
2-phase
encoding of TM13IOA/TM13IOB
pin (1
×
,
4
×
); TM13IOB pin
Interrupt source ........... Timer counter
13
under/overflow; timer counter
13
compare capture A; timer counter
13
compare capture
B
Serial interface
Serial
0
:
8-bit
×
1
(transfer direction of MSB/LSB selectable; transmission / reception of
7, 8-bit
length)
Clock source................
1/2
or
1/16
of timer counter
6
underflow; external pin
Serial
1
:
8-bit
×
1
(transfer direction of MSB/LSB selectable; transmission / reception of
7, 8-bit
length)
Clock source................
1/2
or
1/16
of timer counter
7
underflow; external pin
Serial
2
:
8-bit
×
1
(transfer direction of MSB/LSB selectable; transmission / reception of
7, 8-bit
length)
Clock source................
1/2
or
1/16
of timer counter
8
underflow; external pin
Serial
3
:
8-bit
×
1
(transfer direction of MSB/LSB selectable; transmission / reception of
7, 8-bit
length)
Clock source................
1/2
or
1/16
of timer counter
9
underflow; external pin
UART
×
4
(common use with serial
0
to
3)
I²C
×
2
(common use with serial
0, 1;
single master)
MAE00011GEM
DMA controller
4-ch.
DMA transfer enabled between memory and memory or memory and peripheral register by set interrupt factor and software
activation setting
Transfer unit : bytes/word
Transfer mode :
1
word/burst (max.
128
K bytes)
Transfer addressing : source/destination pointer fix/increment
High-speed transfer enabled between USB-FIFO and internal RAM in single address mode
USB Functions
Conforms to USB1.1.
USB transceiver built-in
Full-speed (12 Mbps) supported.
9
end points (FIFO built-in independently)
FIFO size
(EP0,
1, 2, 3, 4, 5, 6, 7, 8)
:
64, 128, 128, 128, 128, 128, 128, 128, 128
bytes
・EP0
Control transfer
IN/OUT (two ways)
・EP1
to EP8
Interrupt/Bulk/Isochronous transfer supported.
Settable to IN or OUT.
Double Buffering function supported.
When the MAXP size is set to a half or less of the MAXFIFO size for each EP, the Double Buffering function is made valid
automatically.
I/O Pins
I/O
77
Common use :
77
(pull-up resistance specifiable)
A/D converter
Special Ports
Notes
10-bit
×
8-ch.
(with S/H)
USB ports (D+, D-)
4
multiply PLL built-in, generation of internal
48
MHz at external oscillation
12
MHz
Electrical Charactreistics (Supply current)
Parameter
Operating supply current
Supply current at STOP
Supply current at HALT0
Symbol
IDDopr
IDDS
IDDH
Condition
Limit
min
typ
max
Unit
VI = VDD or VSS, output open
65+10
α
* mA
f =
12
MHz , VDD =
3.3
V
Pin with pull-up resistor is open all other input pins and
70
µA
Hi-Z state input/output pins are simultaneously applied
VDD or VSS level
30+10
α
* mA
f =
12
MHz , VDD =
3.3
V, output open
(Ta = –20
°
C to +70
°
C , VDD =
3.3
V, VSS =
0
V)
Note) * "
α
" depends on products.
MN102H74D, MN102H74G
α
=
0
MN102HF74G
α
=
1
Development tools
In-circuit Emulator
PX-ICE102H74-LQFP100-P-1414
MAE00011GEM
MN102H74D, MN102H74G
Pin Assignment
PA5, SBT0, SCL0
PA4, SBO0, SDA0
PA3, SBI0, AN7
PA2, SBT1, AN6, SCL1
PA1, SBO1, AN5, SDA1
PA0, SBI1, AN4
VDD (VPP)
P93, AN3, TM13IOB
P92, AN2, TM13IOA
P91, AN1, TM12IOB
P90, AN0, TM12IOA
VSS
P84, SBT2, TM11IOB
P83, SBO2, TM11IOA
P82, SBI2
VSS
D−
D+
VDD
USBMODE
P81, TM10IOB, STOP
P80, TM10IOA, WDOUT
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
/NMI
PB0, /IRQ0
PB1, /IRQ1
PB2, /IRQ2
PB3, /IRQ3
PB4, /IRQ4
PB5, /IRQ5
/RST
VDD
P00, D00
P01, D01
P02, D02
P03, D03
P04, D04
P05, D05
P06, D06
P07, D07
VSS
P10, D08, (TM2IO)
P11, D09, (TM3IO)
P12, D10, (TM4IO)
P13, D11, (TM5IO)
P14, D12, (TM6IO)
P15, D13, (TM7IO)
P16, D14, (TM8IO)
P17, D15, (TM9IO)
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
*
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
*
MN102H74D
MN102H74G
MAE00011GEM
WAIT, P50
/RE, P51
/WEL, P52
/WEH, P53
/CS0, P60
/CS1, P61
/CS2, P62
/CS3, P63
TM0IO, /BREQ, P64
TM1IO, /BRACK, P65
/WR, P66
/WORD, P67
A00, P20
A01, P21
A02, P22
A03, P23
VDD
BOSC, SYSCLK, P54
VSS
XI
XO
VDD
OSCI
OSCO
MODE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
/CS3S, (TM9IO), SBT3, P72
/CS2S, (TM8IO), SBO3, P71
/CS1S, (TM7IO), SBI3, P70
/CS0S, (TM6IO), A23, P47
(TM5IO), A22, P46
(TM4IO), A21, P45
(TM3IO), A20, P44
VSS
(TM2IO), A19, P43
A18, P42
A17, P41
A16, P40
A15, P37
A14, P36
A13, P35
A12, P34
VDD
A11, P33
A10, P32
A09, P31
A08, P30
A07, P27
A06, P26
A05, P25
A04, P24
LQFP100-P-1414
Note *: Use 4.7 kΩ to 10 kΩ
Request for your special attention and preca
semiconductors de
(1)
If any of the products or technical information described in thi
regulations of the exporting country, especially, those with regar
(2) The technical information described in this book is intended onl
of the products, and no license is granted under any intellectua
company. Therefore, no responsibility is assumed by our comp
company which may arise as a result of the use of technical info
(3) The products described in this book are intended to be used for s
equipment, communications equipment, measuring instruments
Consult our sales staff in advance for information on the followi
–
Special applications (such as for airplanes, aerospace, automo
systems and safety devices) in which exceptional quality and
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book
provement. At the final stage of your design, purchasing, or u
Standards in advance to make sure that the latest specifications s
(5) When designing your equipment, comply with the range of a
(operating power supply voltage and operating environment etc
maximum rating on the transient state, such as power-on, powe
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values
mode, possible to occur to semiconductor products. Measures o
or preventing glitch are recommended in order to prevent physic
(6) Comply with the instructions for use in order to prevent breakd
thermal stress and mechanical stress) at the time of handling, m
damp-proof packing is required, satisfy the conditions, such as s
(7) This book may be not reprinted or reproduced whether wholl
Electric Industrial Co., Ltd. Industrial Co., Ltd.
京公网安备 11010802033920号
EEWORLD
