EEWORLDEEWORLDEEWORLD

Part Number

Search

PTN1206H4371DGBS

Description
RESISTOR, THIN FILM, 0.4 W, 0.5 %, 50 ppm, 4370 ohm, SURFACE MOUNT, 1206, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size117KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
Download Datasheet Parametric View All

PTN1206H4371DGBS Overview

RESISTOR, THIN FILM, 0.4 W, 0.5 %, 50 ppm, 4370 ohm, SURFACE MOUNT, 1206, CHIP, ROHS COMPLIANT

PTN1206H4371DGBS Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
package instructionSMT, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresANTI-SULFUR; LASER TRIMMABLE; NON-INDUCTIVE
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.838 mm
Package length3.2 mm
Package formSMT
Package width1.6 mm
method of packingBULK
Rated power dissipation(P)0.4 W
Rated temperature70 °C
resistance4370 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage200 V
PTN
Vishay Thin Film
Commercial Thin Film Chip Resistors
FEATURES
Lead (Pb)-free or Sn/Pb terminations available
Pb-free
Moisture resistant
Available
High purity alumina substrate
RoHS*
Non-standard values available
COMPLIANT
Will pass + 85 °C, 85 % relative humidity and
10 % rated power
100 % visual inspected per MIL-PRF-55342
Very low noise and voltage coefficient (< - 30 dB)
Non-inductive
Laser-trimmed tolerances to ± 0.1 %
Wraparound resistance less than 10 mΩ
Epoxy bondable termination available
Actual Size
1505
SURFACE MOUNT
CHIPS
These chip resistors are available in both “top side” and
“wraparound” termination styles in a variety of sizes. They
incorporate self passivated, enhanced Tantalum Nitride
films, to give superior performance on moisture resistance,
voltage coefficient, power handling and resistance stability.
The terminations consist of an adhesion layer, a leach
resistant nickel barrier, and solder coating. This product will
out-perform all requirements of characteristic H of
MIL-PRF-55342.
CONSTRUCTION
Passivation
Tantalum
Nitride
Resistive Film
Solder
coating
Nickel barrier
High Purity
Alumina Substrate
Adhesion layer
TYPICAL PERFORMANCE
ABS
TCR
TOL
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Absolute TCR
Absolute Tolerance
Operating Temperature Range
Noise
CASE SIZE
0402
0502
0505
0603
0805
(1)
, 0705
(1)
1005
1010
1206
1505
2208
2010
2512
POWER RATING (mW)
50
100
150
150
200
250
500
400
400
750
800
1000
SPECIFICATIONS
Tantalum nitride
± 25 ppm/°C, ± 50 ppm/°C, ± 100 ppm/°C
± 1.0 %, ± 0.5 % and ± 0.1 %
- 55 °C to + 125 °C
< - 25 dB
MAX. WORKING VOLTAGE
75
75
75
75
100
100
150
200
150
150
200
200
RESISTANCE RANGE - (Ω)
20 - 35K
20 - 65K
20 - 130K
10 - 80K
10 - 301K
10 - 301K
50 - 600K
10 - 1M
10 - 1M
10 - 1.75M
10 - 2M
10 - 3M
- 55 °C to + 125 °C
+ 25 °C
CONDITIONS
Note
(1)
0705 and 0805 are the same (only use 0805 when ordering)
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 60026
Revision: 23-Jan-09
For technical questions, contact: thin-film@vishay.com
www.vishay.com
55
Severe packet loss when transmitting large amounts of data using TI's CC1310
I use a queue to let the data buffer enter the queue first and then exit the queue. Finally, I use the serial port to transmit large data, but there is still serious packet loss or serial port jamming...
hejun_96 Microcontroller MCU
Hardware Implementation of Asynchronous FIFO Based on FPGA
Hardware Implementation of Asynchronous FIFO Based on FPGA...
zxopenljx EE_FPGA Learning Park
Microcontroller low power design resources
[align=center][/align][align=left][size=4] [/size][/align][align=left][size=4]The low power consumption of microcontroller is an important assessment content of electronic game design. This article li...
sigma Electronics Design Contest
Technical Article | Debugging GDVF103V-EVAL using Segger Embedded Studio
Start Segger Embedded Studio from Windows Start or from the desktop iconOpen the Package manager from the Tools menuThe Package manager pops up, select to download and install the GD32VF1xx CPU Suppor...
MamoYU Real-time operating system RTOS
[Summary of Pingtouge's technical support methods] Support channels + detailed explanation of specific methods
[i=s]This post was last edited by Future Developer on 2021-12-3 14:21[/i]When I was browsing forum posts recently, I saw that everyone encountered some problems when using Pingtou Ge's development boa...
未来开发者 Domestic Chip Exchange
Codec is the key to PMP
At present, many PMPs adopt a single-chip solution with a dual-core core chip structure, that is, the CPU (ARM) works in conjunction with the DSP, where the DSP is responsible for Encode/Decode, while...
sjjy Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号