MCC
Features
•
•
•
Low Forward Voltage
Surface Mount device
Very small conduction losses
omponents
21201 Itasca Street Chatsworth
!"#
$
% !"#
BAT54
THRU
BAT54S
250mWatt, 30Volt
Schottky Barrier Diode
Type
Single
Dual
Dual
Dual
Pin
Configuration
(See Page 3)
MCC
Catalog
Number
BAT54
BAT54A
BAT54C
BAT54S
Device
Marking
L4P
L42
L43
L44
Figure 1
Figure 2
Figure 3
Figure 4
SOT-23
A
D
C
B
Maximum Ratings
Continuos Reverse Voltage
Forward Current
Non-Repetitive Peak Forward Current t<1s
Total Power Dissipation @ T
A
= 25°C
Storage Temperature Range
Junction Temperature
Soldering temperature during 10s
V
R
I
F
I
FSM
P
D
T
stg
T
j
T
j
30V
0.3A
1.0mA
250mW
-55°C to 150°C
150°C
260°C
G
F
E
H
J
K
DIMENSIONS
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
Electrical Characteristics @ 25
°C
Unless Otherwise Specified
Ratings
Forward Voltage at
I
F
= 0.1mA
I
F
= 1mA
I
F
= 10mA
I
F
= 30mA
I
F
= 100mA
Reverse Current
Reverse Breakdown
Voltage
Capacitance
Reverse Recovery
Time
Thermal Resistance,
Junction to Ambient
Symbol
Max.
240mV
320mV
400mV
500mV
900mV
2.0 uA
>30V
10pF
5nS
500K/W
Notes
V
F
DIM
A
B
C
D
E
F
G
H
J
K
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
V
R
= 25V
.035
.900
.031
.800
I
R
V
(BR)
C
J
t
rr
R
θJA
Measured at
1.0MHz, V
R
=1.0V
I
F
=I
R
=10mA;
I
(REC)
= 1mA
.037
.950
.037
.950
.079
2.000
inches
mm
www.mccsemi.com
BAT54 thru BAT54S
MCC
Fig.2 :
Average forward current versus ambient
temperature (
δ
= 1).
0.35
IF(av)(A)
Fig.1 :
Average forward power dissipation versus
average forward current.
PF(av)(W)
0.35
0.30
0.25
0.20
0.15
0.10
0.05
IF(av) (A)
0.00
0.00
0.05
0.10
0.15
0.20
δ
=tp/T
tp
T
δ = 0.1
δ = 0.05
δ = 0.2
δ = 0.5
0.30
0.25
δ=1
0.20
0.15
0.10
0.05
δ
=tp/T
T
tp
Tamb(°C)
0.25
0.30
0.00
0
25
50
75
100
125
150
Fig.3 :
Non repetitive surge peak forward current
versus overload duration (maximum values).
Fig.4 :
Relative variation of thermal impedance
junction to ambient versus pulse duration (alumine
substrate 10mm x 8mm x 0.5mm).
Zth(j-a)/Rth(j-a)
IM(A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
I
M
0.2
0.1
0.0
1E-3
1.00
δ
= 0.5
δ
= 0.2
Ta=25°C
δ
= 0.1
Ta=50°C
0.10
T
Single pulse
Ta=100°C
t
δ
=0.5
t(s)
1E-2
1E-1
1E+0
tp(s)
δ
=tp/T
tp
0.01
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
www.mccsemi.com
BAT54 thru BAT54S
MCC
Fig.5 :
Reverse leakage current versus reverse
voltage applied (typical values).
IR(µA)
1E+2
Tj=100°C
Fig.6 :
Reverse leakage current versus junction
temperature.
IR(µA)
1E+4
VR=30V
1E+3
1E+2
1E+1
1E+1
1E+0
1E-1
1E-2
Tj=50°C
1E+0
Tj=25°C
1E-1
VR(V)
0
5
10
15
20
25
30
Tj(°C)
1E-2
0
25
50
75
100
125
150
Fig.7 :
Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
10
F=1MHz
Tj=25°C
Fig.8 :
Forward voltage drop versus forward
current (typical values).
IFM(A)
5E-1
1E-1
Tj=100°C
5
1E-2
Tj=50°C
2
VR(V)
1
1
2
5
10
20
30
Tj=25°C
1E-3
VFM(V)
1E-4
0.0 0.1 0.2
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Pin Configuration - Top View
3
1
Figure 1
2
Figure 2
Figure 3
Figure 4
BAT54
BAT54A
BAT54C
BAT54S
www.mccsemi.com