64KX8 UVPROM, 300ns, CDIP28, CERDIP-28
Parameter Name | Attribute value |
Maker | Renesas Electronics Corporation |
Parts packaging code | DIP |
package instruction | WDIP, |
Contacts | 28 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 300 ns |
JESD-30 code | R-GDIP-T28 |
length | 36.83 mm |
memory density | 524288 bi |
Memory IC Type | UVPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX8 |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | WDIP |
Package shape | RECTANGULAR |
Package form | IN-LINE, WINDOW |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 5.89 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
HN27512G-30 | HN27512G-25 | HN27512P-30 | |
---|---|---|---|
Description | 64KX8 UVPROM, 300ns, CDIP28, CERDIP-28 | 64KX8 UVPROM, 250ns, CDIP28, CERDIP-28 | 64KX8 OTPROM, 300ns, PDIP28, PLASTIC, DIP-28 |
Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
Parts packaging code | DIP | DIP | DIP |
package instruction | WDIP, | WDIP, | DIP, |
Contacts | 28 | 28 | 28 |
Reach Compliance Code | unknow | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 |
Maximum access time | 300 ns | 250 ns | 300 ns |
JESD-30 code | R-GDIP-T28 | R-GDIP-T28 | R-PDIP-T28 |
length | 36.83 mm | 36.83 mm | 35.6 mm |
memory density | 524288 bi | 524288 bit | 524288 bit |
Memory IC Type | UVPROM | UVPROM | OTP ROM |
memory width | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 |
word count | 65536 words | 65536 words | 65536 words |
character code | 64000 | 64000 | 64000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 64KX8 | 64KX8 | 64KX8 |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
encapsulated code | WDIP | WDIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.89 mm | 5.89 mm | 5.7 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
width | 15.24 mm | 15.24 mm | 15.24 mm |