64KX8 OTPROM, 300ns, PDIP28, PLASTIC, DIP-28
| Parameter Name | Attribute value |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 28 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 300 ns |
| JESD-30 code | R-PDIP-T28 |
| length | 35.6 mm |
| memory density | 524288 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.7 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| HN27512P-30 | HN27512G-25 | HN27512G-30 | |
|---|---|---|---|
| Description | 64KX8 OTPROM, 300ns, PDIP28, PLASTIC, DIP-28 | 64KX8 UVPROM, 250ns, CDIP28, CERDIP-28 | 64KX8 UVPROM, 300ns, CDIP28, CERDIP-28 |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Parts packaging code | DIP | DIP | DIP |
| package instruction | DIP, | WDIP, | WDIP, |
| Contacts | 28 | 28 | 28 |
| Reach Compliance Code | compliant | compliant | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 300 ns | 250 ns | 300 ns |
| JESD-30 code | R-PDIP-T28 | R-GDIP-T28 | R-GDIP-T28 |
| length | 35.6 mm | 36.83 mm | 36.83 mm |
| memory density | 524288 bit | 524288 bit | 524288 bi |
| Memory IC Type | OTP ROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 |
| word count | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 64KX8 | 64KX8 | 64KX8 |
| Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | WDIP | WDIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE, WINDOW | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.7 mm | 5.89 mm | 5.89 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm | 15.24 mm |
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