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HN27512G-25

Description
64KX8 UVPROM, 250ns, CDIP28, CERDIP-28
Categorystorage    storage   
File Size153KB,7 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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HN27512G-25 Overview

64KX8 UVPROM, 250ns, CDIP28, CERDIP-28

HN27512G-25 Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Parts packaging codeDIP
package instructionWDIP,
Contacts28
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time250 ns
JESD-30 codeR-GDIP-T28
length36.83 mm
memory density524288 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals28
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX8
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeWDIP
Package shapeRECTANGULAR
Package formIN-LINE, WINDOW
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.89 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm

HN27512G-25 Related Products

HN27512G-25 HN27512P-30 HN27512G-30
Description 64KX8 UVPROM, 250ns, CDIP28, CERDIP-28 64KX8 OTPROM, 300ns, PDIP28, PLASTIC, DIP-28 64KX8 UVPROM, 300ns, CDIP28, CERDIP-28
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code DIP DIP DIP
package instruction WDIP, DIP, WDIP,
Contacts 28 28 28
Reach Compliance Code compliant compliant unknow
ECCN code EAR99 EAR99 EAR99
Maximum access time 250 ns 300 ns 300 ns
JESD-30 code R-GDIP-T28 R-PDIP-T28 R-GDIP-T28
length 36.83 mm 35.6 mm 36.83 mm
memory density 524288 bit 524288 bit 524288 bi
Memory IC Type UVPROM OTP ROM UVPROM
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 28 28 28
word count 65536 words 65536 words 65536 words
character code 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 64KX8 64KX8 64KX8
Package body material CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED
encapsulated code WDIP DIP WDIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE, WINDOW IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 5.89 mm 5.7 mm 5.89 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL
width 15.24 mm 15.24 mm 15.24 mm
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