Ceramic Resonators, Chip Type
Ceramic Resonators, Chip Type
(2 Array Type)
Type:
EFOP
Type:
EFOD
Type:
EFOPS
Type:
EFOPM
Type:
EFODM
Type:
EFOLM
●
Encased in a ceramic package
●
High reliability against soldering heat and mechanical
stress
●
Moisture-proof sealing
●
1.2 mm maximum in thickness (PS/PM/DM/LM)
●
Designed for reflow soldering
●
Flat-bottom plate for better mounting
●
RoHS compliant
■
Features
■
Recommended Applications
●
Clock generator for microprocessors
●
Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
■
Handling Precautions
(See Page 175 to 176)
■
Packaging Specifications
See Page 174, 177
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
F
O
3
5
8
4
Design No.
Product Code
Ceramic
EFO
Resonators
Type
Chip Type with 2-terminals
2 to 13 MHz
P
13.1 to 20 MHz
D
Nominal Oscillation
Frequency
3584
3.58 MHz
1695 16.93 MHz
(Example)
6
7
8
Packaging Style
B Bulk Pack
Embossed
E
Taping
Frequency
Tolerance
±1.0
%
0
±0.3
%
3
±0.5
%
5
10
11
12
1
2
3
4
5
9
E
F
O
4
0
0
4
Design No.
Product Code
Ceramic
EFO
Resonators
Type
Chip Type with 2-terminals
4 to 13 MHz
PM
16 to 20 MHz
LM
30 to 50 MHz
4 to 13 MHz
PS
12 to 20 MHz
DM
Nominal Oscillation
Frequency
4004
4.00 MHz
1695 16.93 MHz
4005
40.0 MHz
(Example)
Packaging Style
B Bulk Pack
Embossed
E
Taping
Frequency
Tolerance
±1.0
%
0
±0.3
%
3
±0.5
%
5
Ceramic Resonators,
Chip Type
Part Number
EFOP
EFOD
EFOPS
EFOPM
EFODM
EFOLM
Frequency range
(MHz)
2.00 to 8.39
8.40 to 13.0
13.1 to 20.0
4.00 to 8.39
8.40 to 13.0
4.00 to 8.39
8.40 to 13.0
12.0 to 20.0
16.0 to 20.0
30.0 to 50.0
Frequency Temperature Characteristics
(–20 to +80 °C)
±0.3 %
±1.0 %
±1.0 %
±0.6 %
±1.0 %
±0.3 %
±1.0 %
±1.0 %
±1.0 %
±0.3 %
Attached Capacitors
(Reference)
33 pF
33 pF
21 pF
33 pF
18 pF
10 pF
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Apr. 2008
– EC171 –
Ceramic Resonators, Chip Type
■
Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFOP]·····2.0
to 13.0 MHz
Manufacturer's Logo
Oscillating Frequency
Serial No.
2.5
1.60±0.20
2.5
[Type EFOP, EFOPM]
(7.30)
Terminal
Electrodes
7.80
+0.50
-0.20
4-(1.30)
+0.30
3.20
-0.20
2-0.9 to 1.2
6–R(0.20)
4-(1.00)
2.50±0.20
2.50±0.20
[Type EFOPM]·····4.0
to 13.0 MHz
Manufacturer's Logo
Oscillating Frequency
Serial No.
1.20 max.
Terminal
Electrodes
(7.30)
(2.70)
3.20
+0.30
– 0.20
7.80
+0.50
– 0.20
6–R(0.20)
2.50±0.20
2–(1.00)
2.50±0.20
[Type EFOPS]·····4.0
to 13.0 MHz
Manufacturer's Logo
Oscillating Frequency
Serial No.
1.20 max.
[Type EFOPS]
1.5
(1.60)
1.5
1.6
4.50±0.20
(0.15)
2.00±0.30
2-0.55
6-(0.60)
2–(0.55)
2–1.50±0.20
2-0.8
[Type EFOD]·····13.1
to 20.0 MHz
Manufacturer's Logo
Oscillating Frequency
Serial No.
1.60±0.20
[Type EFOD]
1.9
(2.70)
1.9
(5.00)
Terminal
Electrodes
5.50
+0.50
–0.20
4–(1.20)
3.20
+0.25
–0.15
6–R(0.20)
4–(1.20)
2-1.2
1.90±0.20
1.90±0.20
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
4.2
2.6
Terminal
Electrodes
4.2
(2.70)
00 Apr. 2008
– EC172 –
Ceramic Resonators, Chip Type
■
Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFODM]·····12.0
to 20.0MHz
Manufacturer's Logo
Oscillating Frequency
Serial No.
1.20 max.
3.9
(2.40)
2.90±0.30
6–R(0.20)
2–(0.80)
2–1.35±0.20
2-0.8
[Type EFODM]
1.351.35
(3.70)
Terminal
Electrodes
4.10±0.20
[Type EFOLM]·····16.0
to 20.0, 30.0 to 50.0 MHz
Manufacturer's Logo
Oscillating Frequency
Serial No.
1.20 max.
[Type EFOLM]
1.6 1.6
Terminal
Electrodes
(3.90)
(3.10)
4.40
+0.50
–0.20
3.60
+0.30
–0.20
2-0.7 to 1.0
6–R(0.20)
2–(0.80)
2–1.60±0.20
■
Test Circuits Diagram
For Oscillation Circuit
+5 V
14 13
11
9
+5 V
14 13
11
9
For Loop Gain
Frequency
1
Ceramic
Resonator
2
1M
3
4
5
7
IN
V1
0.01
1
2
1M
3
4
5
7
4.6
IC
µPD4069UBC,
TC4069UBP
or similar
µPD74HCU,
TC74HCU04AP
or similar
Ceramic Resonators,
Chip Type
Frequency Counter
T.G.
Output
=–20 dBm
Ceramic
Resonator
G=20 log (V0/V1)
OUT
V0 FET probe
10 M min.
2 pF max.
2.00 to 8.39 MHz
8.40 to 50.0 MHz
■
Typical Characteristics ····· Temperature Characteristics
Type EFOP
Type EFOD
Type EFOPS
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
2.0 to 8.39 MHz
8.4 to 13 MHz
–20 0 20 40 60 80
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
–20 0 20 40 60 80
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
Oscillation Frequency Drift(%)
Oscillation Frequency Drift(%)
Oscillation Frequency Drift(%)
4.0 to 8.39 MHz
8.4 to 13 MHz
–20 0 20 40 60 80
Temperature (°C)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Apr. 2008
– EC173 –
Ceramic Resonators, Chip Type
■
Typical Characteristics ····· Temperature Characteristics
Type EFOPM
Type EFODM
Type EFOLM
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
2.0 to 8.39 MHz
8.4 to 13 MHz
–20 0 20 40 60 80
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
–20 0 20 40 60 80
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
Oscillation Frequency Drift(%)
Oscillation Frequency Drift(%)
Oscillation Frequency Drift(%)
30 to 50 MHz
16 to 20 MHz
–20 0 20 40 60 80
Temperature (°C)
■
Packaging Specifications
Supplied in bulk or taped & reel packing style
●
Standard Packing Quantity
Type
EFOP, EFOPM
EFOPS
EFOD, EFODM, EFOLM
Embossed Taping
2500 pcs./reel
2000 pcs./reel
1000 pcs./reel
T
Bulk
500 pcs./bag
●
Dimensions for Reel in mm (not to scale)
[Type EFOP, EFOPM]
Dim.
(mm)
φA
330±5
W
16.4
+2.0
0
φB
80 min.
T
22.4 max.
C
13.0±0.5
t
3 max.
D
21.0±0.8
r
1.0
E
2.0±0.5
E
C
φ
B
Dim.
(mm)
r
D
[Type EFOPS, EFOD, EDODM, EFOLM]
Dim.
(mm)
Dim.
(mm)
φA
180±5
W
12.4
+2.0
0
φB
60 min.
T
18.4 max.
C
13.0±0.5
t
3 max.
D
21.0±0.8
r
1.0
E
2.0±0.5
φ
A
W
t
●
Embossed Taping
[Type EFOP, EFOPM]
t
1
Feeding hole
φD
0
Chip pocket
F E
3.20
[Type EFOPS]
t
1
Feeding hole
P
0
φD
0
Chip pocket
P
2
F E
W
2.00
4.50
E
P
1
t
2
B
2
6.0±0.2
4.6±0.2
4.9±0.2
00 Apr. 2008
B
W
7.80
A
t
2
Dim.
(mm)
Dim.
(mm)
P
1
P
0
Tape running
direction
W
F
E
P
1
B
P
2
Chip Component
A
3.7±0.2
P
2
2.0±0.1
B
A
t
2
Dim.
(mm)
Dim.
(mm)
P
1
Tape running direction
W
F
Chip Component
A
2.6±0.2
P
2
2.0±0.1
B
8.3±0.2 16.0±0.3 7.5±0.1 1.75±0.10 8.0±0.1
P
0
4.0±0.1
φD
0
1.5
+0.1
0
t
1
0.3
t
2
3.5 max.
5.1±0.2 12.0±0.3 5.5±0.1 1.75±0.10 4.0±0.1
P
0
4.0±0.1
φD
0
1.5
+0.1
0
t
1
0.6 max. 3.0 max.
[Type EFOD, EFODM, EFOLM]
t
1
Feeding hole
φD
0
Chip pocket
3.60
F E
W
4.40
B
t
2
P
0
Type EFOLM (Example)
P
2
Tape running direction
Chip Component
A
P
1
A
1
P
2
2.0±0.1
B
2
P
0
4.0±0.1
W
F
E
P
1
Dim. (mm)
A
1
Dim.
(mm)
Dim.
(mm)
12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1
φD
0
1.5
+0.1
0
t
1
t
2
Type EFOD
Type EFODM
Type EFOLM
3.7±0.2
3.4±0.2
4.1±0.2
0.6 max. 3.0 max.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC174 –
Wireless Connectivity
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EEWORLD
