MCF5282CVF80 datasheet, PDF - EEWORLD Datasheet

MCF5282CVF80: DescriptionRISC Microprocessor, 32-Bit, 80MHz, CMOS, PBGA256; CategoryThe embedded processor and controller Microcontrollers and processors; File Size9MB，816 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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RISC Microprocessor, 32-Bit, 80MHz, CMOS, PBGA256

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Motorola ( NXP )
Reach Compliance Code	unknow
bit size	32
JESD-30 code	S-PBGA-B256
Number of terminals	256
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA256,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY
power supply	3/3.3,5 V
Certification status	Not Qualified
speed	80 MHz
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

	MCF5282CVF80	MCF5282CVF66	MCF5282CVM66
Description	RISC Microprocessor, 32-Bit, 80MHz, CMOS, PBGA256	RISC Microcontroller, 32-Bit, FLASH, 40MHz, CMOS, PBGA256, MAPBGA-256	RISC Microprocessor, 32-Bit, 66.67MHz, CMOS, PBGA256,
Is it Rohs certified?	incompatible	incompatible	conform to
Maker	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )
Reach Compliance Code	unknow	compliant	unknown
bit size	32	32	32
JESD-30 code	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
Number of terminals	256	256	256
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	LBGA	BGA
Encapsulate equivalent code	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY, LOW PROFILE	GRID ARRAY
power supply	3/3.3,5 V	3/3.3,5 V	3/3.3,5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
speed	80 MHz	66 MHz	66.67 MHz
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROCONTROLLER, RISC	MICROPROCESSOR, RISC
package instruction	-	MAPBGA-256	BGA, BGA256,16X16,40

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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