STK11C68-S30 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> STK11C68-S30

STK11C68-S30: Description8KX8 NON-VOLATILE SRAM, 30ns, PDSO28, 0.350 INCH, PLASTIC, SOIC-28; Categorystorage storage; File Size71KB，10 Pages; ManufacturerCypress Semiconductor

Download Datasheet Parametric Compare View All

STK11C68-S30 Overview

8KX8 NON-VOLATILE SRAM, 30ns, PDSO28, 0.350 INCH, PLASTIC, SOIC-28

STK11C68-S30 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	SOIC
package instruction	SOP, SOP28,.5
Contacts	28
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	30 ns
Other features	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000
JESD-30 code	R-PDSO-G28
JESD-609 code	e0
length	18.0848 mm
memory density	65536 bi
Memory IC Type	NON-VOLATILE SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of ports	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP28,.5
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2.54 mm
Maximum standby current	0.001 A
Maximum slew rate	0.088 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	8.763 mm

STK11C68-S30 Related Products

	STK11C68-S30	STK11C68-S30I	STK11C68-P30	STK11C68-C30	STK11C68-C30I	STK11C68-P30I
Description	8KX8 NON-VOLATILE SRAM, 30ns, PDSO28, 0.350 INCH, PLASTIC, SOIC-28	8KX8 NON-VOLATILE SRAM, 30ns, PDSO28, 0.350 INCH, PLASTIC, SOIC-28	8KX8 NON-VOLATILE SRAM, 30ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28	8KX8 NON-VOLATILE SRAM, 30ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28	8KX8 NON-VOLATILE SRAM, 30ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28	8KX8 NON-VOLATILE SRAM, 30ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	SOIC	SOIC	DIP	DIP	DIP	DIP
package instruction	SOP, SOP28,.5	SOP, SOP28,.5	DIP, DIP28,.3	DIP, DIP28,.3	DIP, DIP28,.3	DIP, DIP28,.3
Contacts	28	28	28	28	28	28
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns
Other features	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000
JESD-30 code	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28	R-CDIP-T28	R-CDIP-T28	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0
length	18.0848 mm	18.0848 mm	34.67 mm	40.635 mm	40.635 mm	34.67 mm
memory density	65536 bi	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	85 °C	85 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
encapsulated code	SOP	SOP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	SOP28,.5	SOP28,.5	DIP28,.3	DIP28,.3	DIP28,.3	DIP28,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	240	240	240	240	240
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.54 mm	2.54 mm	4.572 mm	4.12 mm	4.12 mm	4.572 mm
Maximum standby current	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A
Maximum slew rate	0.088 mA	0.09 mA	0.085 mA	0.085 mA	0.09 mA	0.09 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	NOT SPECIFIED	NOT SPECIFIED	30
width	8.763 mm	8.763 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Is it lead-free?	Contains lead	Contains lead	Contains lead	-	-	Contains lead
Maker	Cypress Semiconductor	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor

Recommended Resources

How to judge the positive and negative poles of diodes

Simple parallel charger circuit diagram

AC current detection circuit 01

Voice controlled music lantern circuit

Computer motherboard circuit diagram 810 3_18

Switching power supply high voltage constant current source circuit diagram

AD9 won't work anymore: The rules do not allow short circuits. I don't know why the wire can be pulled even though it is smaller than the gap, resulting in a direct short circuit. The original setup either pushed the existin...; 呜呼哀哉 Analog electronics

Share: Lightning strike experiment configuration, differential mode and common mode interference path analysis and design principles: Lightning strikes are a common physical phenomenon and the main source of voltage stress for power adapters. Improper protection can cause power damage or restart, thus affecting the normal operation ...; qwqwqw2088 Analogue and Mixed Signal

Xunwei-i.MX6 development board manual update-non-device tree uboot-modify default environment variables: This document mainly introduces how to modify the default boot parameters of non-device tree uboot. After the iTOP-iMX6 development board is burned, the default is the system parameters and screen par...; 遥寄山川 ARM Technology

How to solve the signal fluctuation from the sensor?: The signal from the sensor is very weak, and the circuit behind it has been amplified and filtered. When the detection quantity remains unchanged, the amplified signal has certain fluctuations. Lookin...; sfcsdc Analog electronics

TMS320C6678 power-on configuration: 1. What is the DSP power-on reset configuration? The DSP big-endian, little-endian, self-starting (boot) mode, PCIe mode, and network coprocessor clock selection need to be selected at power-on reset....; Jacktang DSP and ARM Processors

Signal Isolation Technology: [i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:57[/i] Signal isolation allows digital or analog signals to be transmitted without a galvanic connection across the barrier between the...; fighting Mobile and portable

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components