STK11C68-P30 datasheet, PDF - EEWORLD Datasheet

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STK11C68-P30: Description8KX8 NON-VOLATILE SRAM, 30ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size71KB，10 Pages; ManufacturerCypress Semiconductor

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STK11C68-P30 Overview

8KX8 NON-VOLATILE SRAM, 30ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28

STK11C68-P30 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	DIP, DIP28,.3
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	30 ns
Other features	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	34.67 mm
memory density	65536 bit
Memory IC Type	NON-VOLATILE SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum standby current	0.001 A
Maximum slew rate	0.085 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	7.62 mm

STK11C68-P30 Related Products

	STK11C68-P30	STK11C68-S30I	STK11C68-C30	STK11C68-C30I	STK11C68-P30I	STK11C68-S30
Description	8KX8 NON-VOLATILE SRAM, 30ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28	8KX8 NON-VOLATILE SRAM, 30ns, PDSO28, 0.350 INCH, PLASTIC, SOIC-28	8KX8 NON-VOLATILE SRAM, 30ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28	8KX8 NON-VOLATILE SRAM, 30ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28	8KX8 NON-VOLATILE SRAM, 30ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28	8KX8 NON-VOLATILE SRAM, 30ns, PDSO28, 0.350 INCH, PLASTIC, SOIC-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	SOIC	DIP	DIP	DIP	SOIC
package instruction	DIP, DIP28,.3	SOP, SOP28,.5	DIP, DIP28,.3	DIP, DIP28,.3	DIP, DIP28,.3	SOP, SOP28,.5
Contacts	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns
Other features	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000	SOFTWARE STORE; SOFTWARE RECALL; RETENTION/STORE CYCLE = 100 YEARS/1000000
JESD-30 code	R-PDIP-T28	R-PDSO-G28	R-CDIP-T28	R-CDIP-T28	R-PDIP-T28	R-PDSO-G28
JESD-609 code	e0	e0	e0	e0	e0	e0
length	34.67 mm	18.0848 mm	40.635 mm	40.635 mm	34.67 mm	18.0848 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bi
Memory IC Type	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	85 °C	70 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	DIP	DIP	DIP	SOP
Encapsulate equivalent code	DIP28,.3	SOP28,.5	DIP28,.3	DIP28,.3	DIP28,.3	SOP28,.5
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	240	240	240	240	240
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	2.54 mm	4.12 mm	4.12 mm	4.572 mm	2.54 mm
Maximum standby current	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A
Maximum slew rate	0.085 mA	0.09 mA	0.085 mA	0.09 mA	0.09 mA	0.088 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	NOT SPECIFIED	NOT SPECIFIED	30	30
width	7.62 mm	8.763 mm	7.62 mm	7.62 mm	7.62 mm	8.763 mm
Is it lead-free?	Contains lead	Contains lead	-	-	Contains lead	Contains lead
Maker	Cypress Semiconductor	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor

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