AT24C512BY7-YH25-T datasheet, PDF

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AT24C512BY7-YH25-T: Description64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8; Categorystorage storage; File Size577KB，26 Pages; ManufacturerAtmel (Microchip); Environmental Compliance

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AT24C512BY7-YH25-T Overview

64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8

AT24C512BY7-YH25-T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Atmel (Microchip)
Parts packaging code	SOIC
package instruction	HVSON, SOLCC8,.25
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum clock frequency (fCLK)	0.4 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDDR
JESD-30 code	R-PDSO-N8
JESD-609 code	e4
length	6 mm
memory density	524288 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	65536 words
character code	64000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX8
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Encapsulate equivalent code	SOLCC8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	0.6 mm
Serial bus type	I2C
Maximum standby current	0.000001 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
width	4.9 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE
Base Number Matches	1

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Description	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
Maximum operating temperature	85 °C	85 Cel	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 Cel	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	64KX8	64K X 8	64KX8	64KX8	64KX8	64KX8	64KX8
surface mount	YES	Yes	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Is it Rohs certified?	conform to	-	conform to	conform to	conform to	conform to	conform to
Maker	Atmel (Microchip)	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	SOIC	-	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	HVSON, SOLCC8,.25	-	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.3	SOP, SOP8,.3
Contacts	8	-	8	8	8	8	8
Reach Compliance Code	unknown	-	unknown	unknown	unknown	compliant	compliant
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	0.4 MHz	-	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz
Data retention time - minimum	40	-	40	40	40	40	40
Durability	1000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	1010DDDR	-	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR
JESD-30 code	R-PDSO-N8	-	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e4	-	e4	e4	e4	e4	e4
length	6 mm	-	4.9 mm	4.9 mm	4.9 mm	5.29 mm	5.29 mm
memory density	524288 bit	-	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit
Memory IC Type	EEPROM	-	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
word count	65536 words	-	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	-	64000	64000	64000	64000	64000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVSON	-	SOP	SOP	SOP	SOP	SOP
Encapsulate equivalent code	SOLCC8,.25	-	SOP8,.25	SOP8,.25	SOP8,.25	SOP8,.3	SOP8,.3
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	-	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
power supply	2/5 V	-	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.6 mm	-	1.75 mm	1.75 mm	1.75 mm	2.16 mm	2.16 mm
Serial bus type	I2C	-	I2C	I2C	I2C	I2C	I2C
Maximum standby current	0.000001 A	-	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A
Maximum slew rate	0.003 mA	-	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	1.8 V	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	2.5 V	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
width	4.9 mm	-	3.9 mm	3.9 mm	3.9 mm	5.24 mm	5.24 mm
Maximum write cycle time (tWC)	5 ms	-	5 ms	5 ms	5 ms	5 ms	5 ms
write protect	HARDWARE	-	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE
Base Number Matches	1	-	1	1	1	1	1
Is it lead-free?	-	-	Lead free	Lead free	Lead free	Lead free	Lead free
Humidity sensitivity level	-	-	1	1	1	1	1
Peak Reflow Temperature (Celsius)	-	-	260	260	260	260	260
Maximum time at peak reflow temperature	-	-	40	40	40	40	40

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