|
AT24C512BN-SH-T |
AT24C512B-W-113 |
AT24C512BN-SH-B |
AT24C512BN-SH25-T |
AT24C512BW-SH-B |
AT24C512BW-SH-T |
AT24C512BY7-YH25-T |
Description |
64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
85 °C |
85 Cel |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 Cel |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
64KX8 |
64K X 8 |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
surface mount |
YES |
Yes |
YES |
YES |
YES |
YES |
YES |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
NO LEAD |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Is it lead-free? |
Lead free |
- |
Lead free |
Lead free |
Lead free |
Lead free |
- |
Is it Rohs certified? |
conform to |
- |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Atmel (Microchip) |
- |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Parts packaging code |
SOIC |
- |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
package instruction |
SOP, SOP8,.25 |
- |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
SOP, SOP8,.3 |
SOP, SOP8,.3 |
HVSON, SOLCC8,.25 |
Contacts |
8 |
- |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
unknown |
- |
unknown |
unknown |
compliant |
compliant |
unknown |
ECCN code |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum clock frequency (fCLK) |
0.4 MHz |
- |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
Data retention time - minimum |
40 |
- |
40 |
40 |
40 |
40 |
40 |
Durability |
1000000 Write/Erase Cycles |
- |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
I2C control byte |
1010DDDR |
- |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
JESD-30 code |
R-PDSO-G8 |
- |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-N8 |
JESD-609 code |
e4 |
- |
e4 |
e4 |
e4 |
e4 |
e4 |
length |
4.9 mm |
- |
4.9 mm |
4.9 mm |
5.29 mm |
5.29 mm |
6 mm |
memory density |
524288 bit |
- |
524288 bit |
524288 bit |
524288 bit |
524288 bit |
524288 bit |
Memory IC Type |
EEPROM |
- |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
Humidity sensitivity level |
1 |
- |
1 |
1 |
1 |
1 |
- |
word count |
65536 words |
- |
65536 words |
65536 words |
65536 words |
65536 words |
65536 words |
character code |
64000 |
- |
64000 |
64000 |
64000 |
64000 |
64000 |
Operating mode |
SYNCHRONOUS |
- |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
- |
SOP |
SOP |
SOP |
SOP |
HVSON |
Encapsulate equivalent code |
SOP8,.25 |
- |
SOP8,.25 |
SOP8,.25 |
SOP8,.3 |
SOP8,.3 |
SOLCC8,.25 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
- |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Parallel/Serial |
SERIAL |
- |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
260 |
- |
260 |
260 |
260 |
260 |
- |
power supply |
2/5 V |
- |
2/5 V |
2/5 V |
2/5 V |
2/5 V |
2/5 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.75 mm |
- |
1.75 mm |
1.75 mm |
2.16 mm |
2.16 mm |
0.6 mm |
Serial bus type |
I2C |
- |
I2C |
I2C |
I2C |
I2C |
I2C |
Maximum standby current |
0.000001 A |
- |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
Maximum slew rate |
0.003 mA |
- |
0.003 mA |
0.003 mA |
0.003 mA |
0.003 mA |
0.003 mA |
Maximum supply voltage (Vsup) |
3.6 V |
- |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
1.8 V |
- |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
Nominal supply voltage (Vsup) |
2.5 V |
- |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal pitch |
1.27 mm |
- |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Maximum time at peak reflow temperature |
40 |
- |
40 |
40 |
40 |
40 |
- |
width |
3.9 mm |
- |
3.9 mm |
3.9 mm |
5.24 mm |
5.24 mm |
4.9 mm |
Maximum write cycle time (tWC) |
5 ms |
- |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
write protect |
HARDWARE |
- |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
Base Number Matches |
1 |
- |
1 |
1 |
1 |
1 |
1 |