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AT24C512BN-SH-T

Description
64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
Categorystorage    storage   
File Size577KB,26 Pages
ManufacturerAtmel (Microchip)
Environmental Compliance
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AT24C512BN-SH-T Overview

64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8

AT24C512BN-SH-T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAtmel (Microchip)
Parts packaging codeSOIC
package instructionSOP, SOP8,.25
Contacts8
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum clock frequency (fCLK)0.4 MHz
Data retention time - minimum40
Durability1000000 Write/Erase Cycles
I2C control byte1010DDDR
JESD-30 codeR-PDSO-G8
JESD-609 codee4
length4.9 mm
memory density524288 bit
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply2/5 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Serial bus typeI2C
Maximum standby current0.000001 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3.9 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
Base Number Matches1

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Description 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
Maximum operating temperature 85 °C 85 Cel 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 Cel -40 °C -40 °C -40 °C -40 °C -40 °C
organize 64KX8 64K X 8 64KX8 64KX8 64KX8 64KX8 64KX8
surface mount YES Yes YES YES YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING NO LEAD
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Is it lead-free? Lead free - Lead free Lead free Lead free Lead free -
Is it Rohs certified? conform to - conform to conform to conform to conform to conform to
Maker Atmel (Microchip) - Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Parts packaging code SOIC - SOIC SOIC SOIC SOIC SOIC
package instruction SOP, SOP8,.25 - SOP, SOP8,.25 SOP, SOP8,.25 SOP, SOP8,.3 SOP, SOP8,.3 HVSON, SOLCC8,.25
Contacts 8 - 8 8 8 8 8
Reach Compliance Code unknown - unknown unknown compliant compliant unknown
ECCN code EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 0.4 MHz - 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz
Data retention time - minimum 40 - 40 40 40 40 40
Durability 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte 1010DDDR - 1010DDDR 1010DDDR 1010DDDR 1010DDDR 1010DDDR
JESD-30 code R-PDSO-G8 - R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-N8
JESD-609 code e4 - e4 e4 e4 e4 e4
length 4.9 mm - 4.9 mm 4.9 mm 5.29 mm 5.29 mm 6 mm
memory density 524288 bit - 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type EEPROM - EEPROM EEPROM EEPROM EEPROM EEPROM
Humidity sensitivity level 1 - 1 1 1 1 -
word count 65536 words - 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 - 64000 64000 64000 64000 64000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP - SOP SOP SOP SOP HVSON
Encapsulate equivalent code SOP8,.25 - SOP8,.25 SOP8,.25 SOP8,.3 SOP8,.3 SOLCC8,.25
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL - SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 - 260 260 260 260 -
power supply 2/5 V - 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm - 1.75 mm 1.75 mm 2.16 mm 2.16 mm 0.6 mm
Serial bus type I2C - I2C I2C I2C I2C I2C
Maximum standby current 0.000001 A - 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A
Maximum slew rate 0.003 mA - 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1.8 V - 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V - 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
technology CMOS - CMOS CMOS CMOS CMOS CMOS
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal pitch 1.27 mm - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Maximum time at peak reflow temperature 40 - 40 40 40 40 -
width 3.9 mm - 3.9 mm 3.9 mm 5.24 mm 5.24 mm 4.9 mm
Maximum write cycle time (tWC) 5 ms - 5 ms 5 ms 5 ms 5 ms 5 ms
write protect HARDWARE - HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE
Base Number Matches 1 - 1 1 1 1 1
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