AT24C512B-W-113 datasheet, PDF

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AT24C512B-W-113: Description64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8; Categorystorage; File Size577KB，26 Pages; ManufacturerAtmel (Microchip)

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AT24C512B-W-113 Overview

64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8

AT24C512B-W-113 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	3.6 V
Minimum supply/operating voltage	1.8 V
Rated supply voltage	2.5 V
maximum clock frequency	0.4000 MHz
Processing package description	4.40 MM, LEAD FREE AND HALOGEN FREE, PLASTIC, MO-153AA, TSSOP-8
Lead-free	Yes
EU RoHS regulations	Yes
state	DISCONTINUED
packaging shape	RECTANGULAR
Package Size	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.6500 mm
terminal coating	NICKEL PALLADIUM GOLD
Terminal location	DUAL
Packaging Materials	PLASTIC/EPOXY
Temperature level	INDUSTRIAL
memory width	8
organize	64K X 8
storage density	524288 deg
operating mode	SYNCHRONOUS
Number of digits	65536 words
Number of digits	64K
Memory IC type	I2C/2-WIRE SERIAL EEPROM
serial parallel	SERIAL
Maximum TWC of write cycle	5 ms

AT24C512B-W-113 Related Products

	AT24C512B-W-113	AT24C512BN-SH-B	AT24C512BN-SH-T	AT24C512BN-SH25-T	AT24C512BW-SH-B	AT24C512BW-SH-T	AT24C512BY7-YH25-T
Description	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8	64K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
Maximum operating temperature	85 Cel	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 Cel	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
surface mount	Yes	YES	YES	YES	YES	YES	YES
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
memory width	8	8	8	8	8	8	8
organize	64K X 8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8
Is it lead-free?	-	Lead free	Lead free	Lead free	Lead free	Lead free	-
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	conform to
Maker	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	-	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	-	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.3	SOP, SOP8,.3	HVSON, SOLCC8,.25
Contacts	-	8	8	8	8	8	8
Reach Compliance Code	-	unknown	unknown	unknown	compliant	compliant	unknown
ECCN code	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	-	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz
Data retention time - minimum	-	40	40	40	40	40	40
Durability	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	-	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR
JESD-30 code	-	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-N8
JESD-609 code	-	e4	e4	e4	e4	e4	e4
length	-	4.9 mm	4.9 mm	4.9 mm	5.29 mm	5.29 mm	6 mm
memory density	-	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit
Memory IC Type	-	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
Humidity sensitivity level	-	1	1	1	1	1	-
word count	-	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	-	64000	64000	64000	64000	64000	64000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	SOP	SOP	SOP	SOP	SOP	HVSON
Encapsulate equivalent code	-	SOP8,.25	SOP8,.25	SOP8,.25	SOP8,.3	SOP8,.3	SOLCC8,.25
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	-	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	-	260	260	260	260	260	-
power supply	-	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.75 mm	1.75 mm	1.75 mm	2.16 mm	2.16 mm	0.6 mm
Serial bus type	-	I2C	I2C	I2C	I2C	I2C	I2C
Maximum standby current	-	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A
Maximum slew rate	-	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal pitch	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Maximum time at peak reflow temperature	-	40	40	40	40	40	-
width	-	3.9 mm	3.9 mm	3.9 mm	5.24 mm	5.24 mm	4.9 mm
Maximum write cycle time (tWC)	-	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
write protect	-	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE
Base Number Matches	-	1	1	1	1	1	1

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