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MCM6287BP25

Description
64KX1 STANDARD SRAM, 25ns, PDIP22, 0.300 INCH, PLASTIC, DIP-22
Categorystorage    storage   
File Size172KB,7 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MCM6287BP25 Overview

64KX1 STANDARD SRAM, 25ns, PDIP22, 0.300 INCH, PLASTIC, DIP-22

MCM6287BP25 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
Parts packaging codeDIP
package instructionDIP, DIP22,.3
Contacts22
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time25 ns
I/O typeSEPARATE
JESD-30 codeR-PDIP-T22
JESD-609 codee0
length26.41 mm
memory density65536 bi
Memory IC TypeSTANDARD SRAM
memory width1
Number of functions1
Number of ports1
Number of terminals22
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX1
Output characteristics3-STATE
ExportableNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP22,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum standby current0.015 A
Minimum standby current4.5 V
Maximum slew rate0.12 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
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