MH88636AD-4 datasheet, PDF - EEWORLD Datasheet

MH88636AD-4: DescriptionSLIC, Hybrid, PDIP28,; CategoryWireless rf/communication Telecom circuit; File Size297KB，14 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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MH88636AD-4 Overview

SLIC, Hybrid, PDIP28,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	DIP
Contacts	28
Reach Compliance Code	unknow
JESD-30 code	R-PDIP-T26
Negative supply voltage rating	-5 V
Number of terminals	26
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP26/28,1.0
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	+-5 V
Certification status	Not Qualified
Maximum slew rate	13 mA
Nominal supply voltage	5 V
surface mount	NO
technology	HYBRID
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	MH88636AD-4	MH88636AD-4I	MH88636AS-4
Description	SLIC, Hybrid, PDIP28,	SLIC, Hybrid, PDIP28,	SLIC, Hybrid, PDSO28,
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Microsemi	Microsemi	Microsemi
Parts packaging code	DIP	DIP	SOIC
Contacts	28	28	28
Reach Compliance Code	unknow	unknown	unknow
JESD-30 code	R-PDIP-T26	R-PDIP-T28	R-PDSO-L28
Negative supply voltage rating	-5 V	-5 V	-5 V
Number of terminals	26	28	28
Maximum operating temperature	70 °C	85 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP
Encapsulate equivalent code	DIP26/28,1.0	DIP28,1.0	GWDIP28,1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE
power supply	+-5 V	+-5 V	+-5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	13 mA	13 mA	13 mA
Nominal supply voltage	5 V	5 V	5 V
surface mount	NO	NO	YES
technology	HYBRID	HYBRID	HYBRID
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	L BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
package instruction	-	DIP, DIP28,1.0	SOP, GWDIP28,1
JESD-609 code	-	e0	e0
Number of functions	-	1	1
Telecom integrated circuit types	-	SLIC	SLIC
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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