MH88636AS-4 datasheet, PDF - EEWORLD Datasheet

MH88636AS-4: DescriptionSLIC, Hybrid, PDSO28,; CategoryWireless rf/communication Telecom circuit; File Size297KB，14 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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MH88636AS-4 Overview

SLIC, Hybrid, PDSO28,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	SOIC
package instruction	SOP, GWDIP28,1
Contacts	28
Reach Compliance Code	unknow
JESD-30 code	R-PDSO-L28
JESD-609 code	e0
Negative supply voltage rating	-5 V
Number of functions	1
Number of terminals	28
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	GWDIP28,1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	+-5 V
Certification status	Not Qualified
Maximum slew rate	13 mA
Nominal supply voltage	5 V
surface mount	YES
technology	HYBRID
Telecom integrated circuit types	SLIC
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	L BEND
Terminal pitch	2.54 mm
Terminal location	DUAL

	MH88636AS-4	MH88636AD-4I	MH88636AD-4
Description	SLIC, Hybrid, PDSO28,	SLIC, Hybrid, PDIP28,	SLIC, Hybrid, PDIP28,
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Microsemi	Microsemi	Microsemi
Parts packaging code	SOIC	DIP	DIP
Contacts	28	28	28
Reach Compliance Code	unknow	unknown	unknow
JESD-30 code	R-PDSO-L28	R-PDIP-T28	R-PDIP-T26
Negative supply voltage rating	-5 V	-5 V	-5 V
Number of terminals	28	28	26
Maximum operating temperature	70 °C	85 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	DIP
Encapsulate equivalent code	GWDIP28,1	DIP28,1.0	DIP26/28,1.0
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	IN-LINE
power supply	+-5 V	+-5 V	+-5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	13 mA	13 mA	13 mA
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	NO	NO
technology	HYBRID	HYBRID	HYBRID
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal form	L BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
package instruction	SOP, GWDIP28,1	DIP, DIP28,1.0	-
JESD-609 code	e0	e0	-
Number of functions	1	1	-
Telecom integrated circuit types	SLIC	SLIC	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-

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