IS62C256-70TI datasheet, PDF - EEWORLD Datasheet

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IS62C256-70TI: DescriptionStandard SRAM, 32KX8, 70ns, CMOS, PDSO28, TSOP1-28; Categorystorage storage; File Size36KB，8 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS62C256-70TI Overview

Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, TSOP1-28

IS62C256-70TI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	TSOP
package instruction	TSOP1-28
Contacts	28
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G28
JESD-609 code	e0
length	11.8 mm
memory density	262144 bi
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP28,.53,22
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Minimum standby current	2 V
Maximum slew rate	0.075 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.55 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	8 mm

IS62C256-70TI Related Products

	IS62C256-70TI	IS62C256-45T
Description	Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, TSOP1-28	Standard SRAM, 32KX8, 45ns, CMOS, PDSO28, TSOP1-28
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	TSOP	TSOP
package instruction	TSOP1-28	TSOP1-28
Contacts	28	28
Reach Compliance Code	compli	compli
ECCN code	EAR99	EAR99
Maximum access time	70 ns	45 ns
I/O type	COMMON	COMMON
JESD-30 code	R-PDSO-G28	R-PDSO-G28
JESD-609 code	e0	e0
length	11.8 mm	11.8 mm
memory density	262144 bi	262144 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	8	8
Number of functions	1	1
Number of ports	1	1
Number of terminals	28	28
word count	32768 words	32768 words
character code	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C
organize	32KX8	32KX8
Output characteristics	3-STATE	3-STATE
Exportable	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	TSOP1
Encapsulate equivalent code	TSSOP28,.53,22	TSSOP28,.53,22
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	240
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm
Minimum standby current	2 V	2 V
Maximum slew rate	0.075 mA	0.07 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.55 mm	0.55 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	30	30
width	8 mm	8 mm

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