HN624416TT-12 datasheet, PDF - EEWORLD Datasheet

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HN624416TT-12: DescriptionMASK ROM, 2MX8, 120ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44; Categorystorage storage; File Size68KB，9 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HN624416TT-12 Overview

MASK ROM, 2MX8, 120ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44

HN624416TT-12 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Hitachi （Renesas ）
Parts packaging code	TSOP2
package instruction	TSOP2, TSOP44,.46,32
Contacts	44
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	120 ns
Other features	USER CONFIGURABLE 1M X 16; TTL COMPATIBLE I/O
Spare memory width	8
JESD-30 code	R-PDSO-G44
JESD-609 code	e0
length	18.41 mm
memory density	16777216 bi
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	44
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP44,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00003 A
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm

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	HN624416TT-12	HN624416FB-10	HN624416FB-12	HN624416P-10	HN624416P-12	HN624416TT-10
Description	MASK ROM, 2MX8, 120ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44	MASK ROM, 2MX8, 100ns, CMOS, PDSO44, 0.600 INCH, PLASTIC, SOP-44	MASK ROM, 2MX8, 120ns, CMOS, PDSO44, 0.600 INCH, PLASTIC, SOP-44	MASK ROM, 2MX8, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 2MX8, 100ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	TSOP2	SOIC	SOIC	DIP	DIP	TSOP2
package instruction	TSOP2, TSOP44,.46,32	SOP, SOP44,.63	SOP, SOP44,.63	DIP, DIP42,.6	DIP, DIP42,.6	TSOP2, TSOP44,.46,32
Contacts	44	44	44	42	42	44
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	120 ns	100 ns	120 ns	100 ns	120 ns	100 ns
Other features	USER CONFIGURABLE 1M X 16; TTL COMPATIBLE I/O	USER CONFIGURABLE 1M X 16; TTL COMPATIBLE I/O	USER CONFIGURABLE 1M X 16; TTL COMPATIBLE I/O	USER CONFIGURABLE 1M X 16; TTL COMPATIBLE I/O	USER CONFIGURABLE 1M X 16; TTL COMPATIBLE I/O	USER CONFIGURABLE 1M X 16; TTL COMPATIBLE I/O
Spare memory width	8	8	8	8	8	8
JESD-30 code	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDIP-T42	R-PDIP-T42	R-PDSO-G44
JESD-609 code	e0	e0	e0	e0	e0	e0
length	18.41 mm	28.5 mm	28.5 mm	52.8 mm	52.8 mm	18.41 mm
memory density	16777216 bi	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	44	44	44	42	42	44
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	2MX8	2MX8	2MX8	2MX8	2MX8	2MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	SOP	SOP	DIP	DIP	TSOP2
Encapsulate equivalent code	TSOP44,.46,32	SOP44,.63	SOP44,.63	DIP42,.6	DIP42,.6	TSOP44,.46,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	3 mm	3 mm	5.06 mm	5.06 mm	1.2 mm
Maximum standby current	0.00003 A	0.00003 A	0.00003 A	0.00003 A	0.00003 A	0.00003 A
Maximum slew rate	0.1 mA	0.12 mA	0.1 mA	0.12 mA	0.1 mA	0.12 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal pitch	0.8 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10.16 mm	12.6 mm	12.6 mm	15.24 mm	15.24 mm	10.16 mm

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