21554AA datasheet, PDF - EEWORLD Datasheet

21554AA: DescriptionBus Controller, PBGA304; CategoryThe embedded processor and controller Microcontrollers and processors; File Size339KB，12 Pages; ManufacturerDigital Equipment Corp

Download Datasheet Parametric View All

21554AA Overview

Bus Controller, PBGA304

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Digital Equipment Corp
package instruction	BGA, BGA304,23X23,50
Reach Compliance Code	unknow
JESD-30 code	S-PBGA-B304
JESD-609 code	e0
Number of terminals	304
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA304,23X23,50
Package shape	SQUARE
Package form	GRID ARRAY
power supply	3.3,3.3/5 V
Certification status	Not Qualified
surface mount	YES
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM

Monostable delay circuit composed of single op amp: Monostable delay circuit composed of single op ampAuthor: Unknown Source: Unknown Added Date: 2005-1-7 2618　The monostable delay circuit is composed of a single operational amplifier connected as a vo...; fighting Analog electronics

Looking for a constant current chip: The constant current driver chip on the LED lamp is broken. The size of the chip is about 5mm*2mm. The mobile phone cannot take a picture of it. There are only five digits printed on it, 42061 (or 420...; allenhu PCB Design

[National Technology N32G457 Review] RT_Thread Studio transplants USB virtual serial port: Using the built-in USB function of N32G45, connect the computer USB, virtualize a USB serial port, and realize data communication between the computer and the development board. The official MDK provi...; lugl4313820 Domestic Chip Exchange

Xunwei 4418 development board Linux system TFTP transfer file: TFTP (Trivial File Transfer Protocol) is a protocol based on UDP protocol for simple file transfer between client and server. It is suitable for low-cost and uncomplicated applications. TFTP protocol ...; 遥寄山川 ARM Technology

Thermal Design of Semiconductor Components: Heat Transfer and Heat Dissipation Paths: Heat is transferred through objects and space. Transfer is the movement of heat from a source to another location.Three forms of heat transferThere are three main forms of heat transfer: conduction, c...; btty038 RF/Wirelessly

【Qinheng Trial】Implementation of USB HID: [i=s]This post was last edited by viphotman on 2019-7-24 13:57[/i]Simulate the left and right mouse buttons by touching the buttons; File structure:mainly integrates the functions of gpio, touch and u...; viphotman Domestic Chip Exchange

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components